Covering membrance with electromagnetic shielding function and manufacturing method of covering membrance

A covering film, epoxy resin technology, applied in the fields of magnetic field/electric field shielding, chemical instruments and methods, electrical components, etc., can solve the problems of poor flexibility of stainless steel sheets, increased thickness of circuit boards, affecting the flexibility of flexible circuit boards, etc. , to achieve the effect of simple production and reduced thickness

Active Publication Date: 2012-03-14
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the weight of the stainless steel sheet is relatively large, thereby increasing the weight of the circuit board product
And the flexibility of the stainless steel sheet is poor, and the electromagnetic shielding layer made of stainless steel sheet affects the flexural performance of the flexible circuit board
Moreover, since the cover film and the stainless steel sheet are attached to the circuit board at the same time, the thickness of the circuit board is increased

Method used

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  • Covering membrance with electromagnetic shielding function and manufacturing method of covering membrance
  • Covering membrance with electromagnetic shielding function and manufacturing method of covering membrance
  • Covering membrance with electromagnetic shielding function and manufacturing method of covering membrance

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Embodiment Construction

[0020] The covering film with electromagnetic shielding effect and its manufacturing method provided by the technical solution will be further described in detail below in conjunction with the embodiments.

[0021] see figure 1 , The technical solution provides a covering film 100, which includes an insulating base material layer 110, an epoxy resin composite material layer 120, and an adhesive layer 130 stacked in sequence.

[0022] The insulating substrate layer 110 is used to carry the epoxy resin composite material layer 120 and play a role of electrical insulation. In this embodiment, the insulating base layer 110 is made of polyimide. The thickness of the insulating substrate layer 110 can be set according to actual needs, and its thickness can be 10 microns to 50 microns, preferably 25 microns.

[0023] The epoxy composite material layer 120 is used for electromagnetic shielding. The thickness of the epoxy resin composite material layer 120 can be set according to th...

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Abstract

The invention relates to a covering membrance, which comprises an insulation base material layer, an epoxy resin composite material layer and an adhesive layer which are stacked in sequence, wherein the epoxy resin composite material layer is positioned between the insulation base material layer and the adhesive layer and is formed by an epoxy resin composite material, the epoxy resin composite material comprises carboxy terminal polymer modified epoxy resin, a carbon nanometer tube and inorganic dispersion materials, and the mass percentage of the carbon nanometer tube in the epoxy resin composite material is 4.6-16. The invention also provides a manufacturing method of the covering membrance.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a covering film applied in the production of circuit boards and having an electromagnetic shielding effect and a manufacturing method thereof. Background technique [0002] With the advancement of science and technology, printed circuit boards have been widely used in the electronic field. For the application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] As the number of layers of circuit board products increases, electromagnetic interference often occurs when the circuit board products are actually working, which affects the signal transmission of the circuit board. In this way, an electromagnetic shielding layer needs to be provided i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00B32B27/08B32B27/18B32B27/34B32B27/38C08L63/02C08K3/34C08K7/00C08K3/04
Inventor 何明展
Owner AVARY HLDG (SHENZHEN) CO LTD
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