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Control module, in particular gear or motor control module for a motor vehicle

A transmission control and control module technology, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as structural troubles, achieve the effects of reducing the risk of cracking and improving heat conduction

Inactive Publication Date: 2012-03-21
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The disadvantage of this housing is that a structurally complex metal housing is required, since it is a two-part metal housing and has an additional seal for enclosing the circuit carrier

Method used

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  • Control module, in particular gear or motor control module for a motor vehicle
  • Control module, in particular gear or motor control module for a motor vehicle
  • Control module, in particular gear or motor control module for a motor vehicle

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] figure 1 A schematic plan view of a control module is shown, in which a web structure formed with a plurality of wires is integrated as a heat sink. A coordinate system is used to describe the spatial location of individual components.

[0033]The control module 10 has a plastic housing 12 , which is preferably produced using the so-called “molding” method, in which a cooling body 14 is integrated, which here is designed as a web structure 16 , said The web structure 14 may also be referred to as a knit. Below or above the web structure 16 , parallel to the xy-plane of the coordinate system 18 , a circuit carrier (not shown) is arranged, which is equipped with a multitude of electronic and electrical components. In order to achieve as effective a heat conduction as possible between the circuit carrier or components located thereon and the cooling body 14 , the cooling body 14 is arranged at the smallest possible distance from the circuit carrier. The heat dissipation...

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PUM

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Abstract

The invention relates to a control module, in particular a gear or a motor control module for a motor vehicle. The module has an interconnect device including a set of electronic and / or electrical components and surrounded by a plastic material that forms a plastic housing. The plastic housing includes a set of connectors electrically connected with the components. The housing includes a heat dissipater for heat dissipation from the interconnect device. The heat dissipater is penetrated from the plastic material and runs parallel to the interconnect device. The plastic material penetrates through a large-sized heat dissipater, thereby effectively transmitting heat generated by components to the outside of the heat dissipater. Moreover, the plastic material forming the housing penetrating through the an elastic heat dissipater at least along one spatial direction compensates different expansion coefficient of the heat dissipater, the interconnect device, and the plastic housing, thereby preventing cracking due to stress under different temperature.

Description

technical field [0001] The invention relates to a control module, in particular for a transmission control module or a motor control module of a motor vehicle. Background technique [0002] In order to improve the cooling effect, the control unit often has a cooling plate arranged below the circuit carrier. The circuit carrier together with the cooling plate, which is preferably in direct contact, is completely extrusion-coated in the mold with a plastic material (molding compound), which, apart from the positional fixation of the components and their electrical insulation, is simultaneously The air-tight seal encloses sensitive circuit carriers. In this case, the cooling plate has at least one web protruding from the plastic housing of the mechatronic module. In order to dissipate the heat loss of structural elements located on the circuit carrier, the web protruding from the plastic housing is connected to a heat sink that is ideally at a lower temperature level, such as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH01L23/3733H01L23/4334H01L2924/0002H01L2924/09701H01L2924/00
Inventor U.利斯科夫
Owner ROBERT BOSCH GMBH