Electronic part

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component with high reliability which can suppress generation of minor cracks in an electronic component element assembly when connecting an external electrode with an external terminal in the electronic component element assembly.SOLUTION: An electronic component 10 with an external terminal which is the electronic component related to this invention comprises: a ceramic element assembly 12 of a laminated type ceramic capacitor which is an electronic component element assembly; an external electrode 14 to be formed to the ceramic element assembly; an external terminal 18 to be connected with the external electrode through a solder 16 for terminal connection; and a coating resin 20 which covers the whole of the ceramic element assembly and a part of the external terminal. The external terminal has a connection part 22 and an extension part 24 which is extended from the connection part 22 toward a predetermined direction. The external terminal includes: a base material 26; a metal layer 28 to be formed on the surface of the base material 26; and a processing part 30 where a part of the surface in the extension part of the external terminal is processed into a concave by removing the metal layer formed on the surface of the base material of the external terminal in the vicinity of the connection part.

Description

technical field [0001] The present invention relates to an electronic component, in particular to an electronic component with external terminals, such as a capacitor and the like. Background technique [0002] In general, eutectic solder (はんだ) with a low melting point is used for electronic components having leads that are external terminals. [0003] However, since lead is contained in this eutectic solder, and this lead component has adverse effects on the environment, the use of lead is restricted, and lead-free solder is sought, and lead-free solder is used except for some applications. [0004] Therefore, at present, the solder for terminal joining is gradually shifting from eutectic solder to lead-free solder such as Sn—Cu based solder. In addition, in consumer applications, it is mainly based on the premise of flow solder mounting (実 mounting), and in the market that requires high reliability centered on the automotive market, soldering-based mounting or use at high...

AI Technical Summary

Problems solved by technology

Therefore, in order to avoid the generation of this crack, the shape of the external terminal must be designed so that the flat edge does not reach the external electrode terminal, so there is a defect that the product external dimension of the electronic component becomes large.

[0010] In addition, in the electronic component described in Patent Document 2, since a part of the part (the base material of the lead wire) after removing the solder plating layer is exposed, Cu or Fe in the exposed part may be partially oxidized, resulting in blackening and cracking. Problems with the appearance of red rust

In addition, when the lead wire is made of Cu, if the Cu of the base material is partially exposed, from the viewpoint of the accuracy of powder coating, the length of the exposed part is difficult to control, and the length of the part with different colors may vary, which will deteriorate the appearance quality. worsening problem

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