Uniform gas flow gas inlet device and uniform gas inlet method for vapor deposition
A vapor deposition, air inlet technology, applied in gaseous chemical plating, metal material coating process, coating and other directions, can solve the problems of uneven thickness and little effect on product uniformity, to improve the yield, improve The effect of uneven wall thickness and easy operation
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Embodiment 1
[0027] see Figure 1-2 , a uniform gas flow inlet device for vapor deposition, its overall shape is "L" shape, the gas inlet device includes a raw material gas mixing chamber 2 with a circular hole-shaped inlet hole 1, and a mixing chamber 2 Connected cuboid air outlet channels 3 and 4 have the same air outlet direction and different lengths, and the length ratio of the two air outlet channels is 1:0.4.
[0028] In the mixing chamber 2, a deflector is arranged at the position where the two outlet passages 3, 4 are connected to the mixing chamber 2, and the deflector is connected to the two outlet passages respectively; the cross-sectional shape of the deflector is It is in the shape of a right-angle fan, and the right-angle side of the right-angle fan-shaped deflector 5 is connected to the shorter air outlet channel 4, and the arc side of the right-angle fan-shaped deflector 5 is connected to the longer air outlet channel 3.
[0029] The air intake direction of the air inlet ...
Embodiment 2
[0031] The air inlet device as described in Embodiment 1 is different in that: the length ratio of the two air outlet channels 3 and 4 is 1:0.5.
Embodiment 3
[0033] A method for using the above-mentioned air inlet device for uniform air intake in a vapor deposition reaction, comprising placing the above-mentioned air inlet device at the air inlet of a vapor deposition furnace, and making the distance between the mold in the vapor deposition furnace and the air inlet The short air outlet channel mouth 2 centimeters in the device, the longer air outlet channel 3 is located on one side of the mould.
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