Resist coating equipment for the manufacture of printed circuit boards

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for applying resist on an edge part of a mother board including a copper foil laminate.SOLUTION: A resist application apparatus comprises: a loading part for loading a mother board including a copper foil laminate; a transportation part for moving the loaded mother board including the copper foil laminate to a set position for resist application; a resist application part 100 for applying liquid resist on an edge part of the moved mother board including the copper foil laminate; an UV ray irradiation part for irradiating with a UV ray the edge part on which the resist has been applied; an unloading part for discharging the mother board including the copper foil laminate with the edge part coated with the resist; and a control part for controlling the loading part, the transportation part, the resist application part, the UV ray irradiation part, and the unloading part. Thus, the contamination of the board or a plating tank with resin, glass fiber, copper foils, or other extraneous matters can be prevented, and surface treatment cost of gold plating or the like can be reduced.

Description

[0001] Cross References to Related Applications [0002] This application claims the priority of Korean Patent Application No. 10-2010-0082925 filed on Aug. 26, 2010, entitled "Resist Coating Apparatus for Manufacturing Printed Circuit Boards". technical field [0003] The present application relates to a resist coating apparatus for the manufacture of printed circuit boards, and more particularly, to a resist coating apparatus for the manufacture of printed circuits capable of avoiding separation of insulators, copper foil, etc., and reducing unnecessary costs for surface treatment Plate resist coating equipment. Background technique [0004] A printed circuit board (PCB) is an electronic component in which various components can be mounted and electrically connected to each other through the integration of wiring. As the market size of related industries (for example, semiconductors, multimedia devices, communication devices, various electronic products, various automobil...

AI Technical Summary

Problems solved by technology

Here, since the edge 11 of the mother sheet 10 is not specially treated, when the mother sheet moves to pass through each processing procedure, the resin, copper foil, glass fiber, etc. of the mother sheet flow to the outside due to friction, and as a result, the plating tank, etc. are gradually polluted. , or be adsorbed on the master, resulting in defective products (see Figure 1B )

[0008] In addition, in the case of surface treatment with gold plating, the copper component present on the edge of the copper-clad laminate mother is unnecessarily plated (although it is discarded after the chip dicing process is completed), resulting in an increase in the manufacturing cost of the substrate

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