Heat radiator

A heat sink and heating element technology, applied in the direction of electric solid devices, semiconductor devices, semiconductor/solid device components, etc., can solve the problem of insufficient heat removal effectively

Inactive Publication Date: 2012-05-09
JOINSET +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the related technology is not enough to effectively remove the heat

Method used

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  • Heat radiator
  • Heat radiator
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Examples

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Embodiment Construction

[0052] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0053] Figure 1A , Figure 1B with Figure 1C are perspective views respectively showing different heat sinks 1, 10 and 20 according to embodiments of the present invention.

[0054] Such as Figure 1A As shown in , the heat sink 1 has a three-dimensional (3D) rectangular shape. The heat sink 1 includes: a horizontal back 5 and a front 3; a main body 2 made of thermally conductive ceramics or carbonaceous materials. A metal layer 4 surrounds both sides of the body 2 in order to be able to apply reflow soldering to the solder paste. However, the heat sink 1 is not limited to the above structure, and the metal layer 4 may be formed only on the rear surface of the main body 2 . The heat sink 1 can be reflow soldered to solder paste through the metal layer 4 formed at least on the back side.

[0055] The heat sink 1 according to the present emb...

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PUM

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Abstract

The invention relates to a heat radiator, which is characterized in that: the heat radiator can be surface mounted, the heat radiator is in a three-dimensional shape and comprises a main body which is made of metal, the main body is provided with a horizontal back surface and at least partial horizontal front surface, so partial front surface can be mounted on a conductive pattern of the printed circuit board (PCB) through alignment, and the back surface can be attached to the conductive pattern through backflow welding.

Description

technical field [0001] The present invention relates to a heat sink, and more particularly to a heat sink whose front side is taken and surface-mounted and whose back side is reflowed by solder paste A conductive pattern soldered to a printed circuit board (PCB). [0002] In addition, the present invention relates to a small heat sink capable of more effectively dissipating and cooling heat generated from a heat generating element via a conductive pattern of a PCB disposed adjacent to the heat generating element, and capable of being easily mounted at a low cost on a conductive pattern. Background technique [0003] Recently, the size and weight of portable electronic communication devices (eg, mobile phones) have decreased while data processing speed and capabilities have increased. Accordingly, a large amount of heat is generated from the semiconductor chip that provides the main functions of the device, which deteriorates the performance of the semiconductor chip (eg, r...

Claims

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Application Information

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IPC IPC(8): H01L23/36H01L23/367H05K1/02H05K1/18
CPCH01L2924/0002H01L2924/00
Inventor 金善基
Owner JOINSET
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