Energy ray-curable epoxy resin composition having excellent fast curing properties
A technology of epoxy resin and composition, applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problem of slow curing speed of epoxy resin, and achieve the effect of improving curing speed and high fixing accuracy
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Embodiment 1~6 and comparative example 1~2
[0047] Based on the ratio shown in Table 1, the photoacid generator PI2074 or CPI-210S was dissolved in 4-butyrolactone, and added to EPICLON 850, stirred until transparent to prepare the energy rays of Comparative Examples 1 and 2 Curable epoxy resin composition.
[0048] Based on the proportions shown in Table 1, OXT-191 was added to the epoxy resin composition of Comparative Example 1 or 2, and stirred until uniform, to prepare the energy ray-curable epoxy resin compositions of Examples 1-6.
[0049] Table 1
[0050]
[0051] EPICLON 850: Bisphenol A type epoxy resin (manufactured by DIC Corporation)
[0052] OXT-191: Oxetanyl silicate (manufactured by Toagosei Co., Ltd.)
[0053] PI2074: Ionium salt-based photoacid generator (manufactured by Rhodia Corporation)
[0054] CPI-210S: Sulphonium-based photoacid generator (manufactured by San-Apro)
[0055] 4-butyrolactone: solvent (manufactured by Wako Pure Chemical Industries, Ltd.)
Embodiment 7~11 and comparative example 3
[0061] Based on the compounding ratio shown in Table 3, the energy-ray-curable epoxy resin composition of Examples 7-11 and the comparative example 3 was prepared.
[0062] table 3
[0063]
[0064] EPICLON 860: Bisphenol A type epoxy resin (manufactured by DIC Corporation)
[0065] OXT-211: 3-ethyl-3-(phenoxymethyl)oxetane (manufactured by Toagosei Co., Ltd.)
[0066] OXT-121: 1,4-bis[{(3-ethyl-3-oxetanyl)methoxy}methyl]benzene (manufactured by Toagosei Co., Ltd.)
[0067] OXT-191: Oxetanyl silicate (manufactured by Toagosei Co., Ltd.)
[0068] PI2074: Ionium salt-based photoacid generator (manufactured by Rhodia Corporation)
[0069] DETX-S: 2,4-diethylthioxanthone (sensitizer: manufactured by Nippon Kayaku Co., Ltd.)
[0070] CPI-210S: Sulphonium-based photoacid generator (manufactured by San-Apro)
[0071] Art Parl GS-350T: Acrylic / styrene copolymer filler (manufactured by Negami Kogyo Co., Ltd.)
Embodiment 12~14
[0082] Based on the compounding ratio shown in Table 6, the energy ray-curable epoxy resin composition of Examples 12-14 was prepared.
[0083] Table 6
[0084]
[0085] X-40-2670: Alicyclic epoxy silicate (manufactured by Shin-Etsu Chemical Co., Ltd.)
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Abstract
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