Electrostatic attracting structure and fabricating method therefor

An electrostatic adsorption and structure technology, which is applied in the manufacture of semiconductor/solid-state devices, holding devices using electrostatic attraction, and manufacturing tools, etc., which can solve the problems of overall complicated work and increased cost.

Active Publication Date: 2012-05-23
CREATIVE TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in such an electrostatic adsorption structure, in order to form predetermined electrodes on both sides of the inter-electrode insulating layer, for example, when using conductive ink to print electrodes of a predetermined shape, a conductive ceramic material is thermally sprayed to obtain regulations. In the case of electrodes with different shapes, both the front and back surfaces of the inter-electrode insulating layer need to be treated twice, so the overall operation becomes complicated, and it also becomes a cause of cost increase.

Method used

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  • Electrostatic attracting structure and fabricating method therefor
  • Electrostatic attracting structure and fabricating method therefor
  • Electrostatic attracting structure and fabricating method therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] in figure 1 as well as figure 2 Here, an electrostatic chuck device using the electrostatic adsorption structure X of Example 1 of the present invention as a means for adsorbing and holding a semiconductor substrate such as a silicon wafer by a semiconductor manufacturing process such as plasma etching is shown.

[0032] In the electrostatic chuck device of the first embodiment, the electrostatic adsorption structure X as the adsorption / holding unit of the semiconductor substrate has the sheet members 5 and 15 and the adsorption power source 4, and is equipped with a pipe (not shown) through which a cooling medium flows. A base body 7 made of aluminum, etc., is integrally formed to constitute an electrostatic chuck device, and the dielectric body 2 of the sheet member 5 in the electro-adsorption structure X is used as an adsorption surface to adsorb and hold a semiconductor substrate 8 such as a silicon wafer.

[0033] Here, the surface of the dielectric 1 made of a polyimid...

Embodiment 2

[0038] in Figure 3 ~ Figure 5 In the figure, a display / disclosure device using the electrostatic adsorption structure X of Example 2 of the present invention as a display unit for display / disclosure is shown.

[0039] In the display / revelation device of the second embodiment, the electrostatic adsorption structure X as the above-mentioned display unit has sheet members 25 and 35 and a suction power source 14, so that the dielectric 32 side of the sheet member 35 can be attracted to, for example, the wall surface 10. The disclosure 9 made of a sheet made of paper or resin is attracted to the dielectric 22 side of the sheet member 25.

[0040] Here, a PET film (dielectric) 21 having a size of 400 mm in length × 600 mm in width × 50 μm in thickness is screen-printed with carbon ink (JELCON type CH-10 manufactured by Jujo Chemical Co., Ltd.) to form 350 mm in length × 550 mm in width. × an electrode 23 with a thickness of 10 μm, and then screen printing an insulating ink (JELCON type...

Embodiment 3

[0047] in Image 6 Here, a modification example of the electrostatic adsorption structure X used in the above-mentioned Example 2 is shown. Using two sheet members 25 on which the electrostatic adsorption structure X in Example 2 was formed, a sheet member 45 was further placed between them, and three sheet members were laminated to form the electrostatic adsorption structure of Example 3 X. Among them, the sheet member 45 is formed in the same manner as the sheet member 25 except that the entire surface of the sheet member 45 is provided with an electrode 43 of 350 mm in length × 550 mm in width × 10 μm in thickness, without forming an opening. In addition, in the electrostatic adsorption structure X of Example 3, two adsorption power sources 14 are used to apply a voltage between the electrodes of opposing sheet members, and it is formed in the same manner as in Example 2 except for that.

[0048] In addition, in the electrostatic adsorption structure X of the third embodiment...

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Abstract

Provided are an electrostatic attracting structure, which electrically attracts an object to be attracted when used and which allows a strongly integrated structure to be maintained when used, and also allows the structure to be changed freely in configuration after the use, and a method of fabricating the same. The electrostatic attracting structure includes: a plurality of sheet members each having an electrode which is sandwiched between two dielectric materials; and at least one attraction power source, in which the plurality of sheet members are stacked, and by applying a voltage between the electrodes of facing sheet members by the at least one attraction power source, the facing sheet members are electrically attracted and fixed, when the electrostatic attracting structure is used, the dielectric material of any one of or both of outermost sheet members each corresponding to an outermost top surface layer or an outermost back surface layer attracts the object to be attracted, and after the use, the stacked plurality of sheet members are made separable from one another by canceling the application of the voltage. Further, by stacking the plurality of sheet members by fixing unit while subjecting the plurality of sheet members to positioning among one another, such electrostatic attracting structure can be obtained easily and reliably.

Description

Technical field [0001] The present invention relates to an electrostatic adsorption structure that electrically adsorbs an object to be adsorbed and a method of manufacturing the same. More specifically, it relates to an electrostatic adsorption structure that forms a fastened integral structure during use and can freely change the structure of the structure after use And its manufacturing method. Background technique [0002] The electrostatic adsorption structure that electrically adsorbs and holds an object to be adsorbed is used for adsorbing and holding semiconductor substrates and glass substrates, and is used for adsorbing and holding sheets such as paper and resin for various purposes. Electrostatic adsorption structures usually sandwich the electrodes with dielectrics from the top and bottom, and apply a voltage to the electrodes through the adsorption power supply, so that the surface of one of the dielectrics is used as the adsorption surface to adsorb the adsorbed obj...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H02N13/00
CPCH01L21/6833H02N13/00Y10T29/49117B23Q3/15
Inventor 藤泽博河合慈辰己良昭
Owner CREATIVE TECH CORP
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