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Processing method of aluminum surface of aluminum base copper clad laminate

A technology of aluminum-based copper clad laminates and processing methods, which is applied to the secondary processing of printed circuits, cleaning/polishing of conductive patterns, and electrical components, etc., can solve the problems of large environmental pollution, low efficiency, and high cost, and achieve low environmental pollution. High processing efficiency and stable performance

Active Publication Date: 2014-04-16
SHENZHEN KINWONG ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using sand blasting treatment, the cost is low, but the performance is unstable; using anodic oxidation treatment, although the performance is stable, but the efficiency is low, the cost is high, and the pollution to the environment is large

Method used

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  • Processing method of aluminum surface of aluminum base copper clad laminate
  • Processing method of aluminum surface of aluminum base copper clad laminate

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Embodiment Construction

[0024] The present invention provides a method for treating the aluminum surface of an aluminum-based copper-clad laminate. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0025] The invention discloses a method for treating the aluminum surface of an aluminum-based copper-clad laminate, which comprises the following steps:

[0026] After the aluminum plate of the aluminum-based copper clad laminate is fixed, it is preferentially fixed on the vertical cleaning line to facilitate the implementation of steps A and B. First of all, it is cleaned, step A, using at least one strong acid solution to degrease the surface of the aluminum plate, and then wa...

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Abstract

The invention discloses a processing method of an aluminum surface of an aluminum base copper clad laminate. Oil removing processing is conducted on the surface of an aluminum plate through acid solution, alkaline degreasing processing is conducted on the surface of the aluminum plate through caustic solution, impurities, greasy dirt, oxide and the like on the surface of the aluminum plate are removed, and simultaneously the aluminum surface is coarsened. The surface of the aluminum plate is washed by using pressurization deionized water, a layer of surface finishing agent is coated evenly on the surface of the aluminum plate after the aluminum plate is dried, and then the surface of the aluminum plate is dried so as to finish processing of the aluminum surface of the aluminum base copper clad laminate. The processing method is high in processing efficiency, low in cost, stable in performance and small in environment pollution, and phenomena of falling of medium layers and edge breaking do not occur after testing of mechanical processing. The surface of the aluminum plate is processed by means of the processing method so as to fully meet requirements of mechanical machining in a PCB manufacture process.

Description

technical field [0001] The invention relates to an aluminum plate surface cleaning process, in particular to a treatment method for the aluminum surface of an aluminum-based copper-clad plate. Background technique [0002] With the development of electronic products to be light, thin, small, high density and multifunctional, the assembly density and integration of components on printed boards are getting higher and higher, the power consumption is getting bigger and bigger, and the heat dissipation requirements of PCB substrates are getting higher and higher. The more urgent it is, if the heat dissipation of the substrate is not good, it will lead to overheating of the components on the printed circuit board, thereby reducing the reliability of the whole machine; under this background, a high heat dissipation aluminum-based copper clad laminate was born. In view of the structure and performance characteristics of aluminum-based copper clad laminates, during mechanical proces...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/26
Inventor 陈毅龙赖海平何新荣
Owner SHENZHEN KINWONG ELECTRONICS