Processing method of aluminum surface of aluminum base copper clad laminate
A technology of aluminum-based copper clad laminates and processing methods, which is applied to the secondary processing of printed circuits, cleaning/polishing of conductive patterns, and electrical components, etc., can solve the problems of large environmental pollution, low efficiency, and high cost, and achieve low environmental pollution. High processing efficiency and stable performance
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[0024] The present invention provides a method for treating the aluminum surface of an aluminum-based copper-clad laminate. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0025] The invention discloses a method for treating the aluminum surface of an aluminum-based copper-clad laminate, which comprises the following steps:
[0026] After the aluminum plate of the aluminum-based copper clad laminate is fixed, it is preferentially fixed on the vertical cleaning line to facilitate the implementation of steps A and B. First of all, it is cleaned, step A, using at least one strong acid solution to degrease the surface of the aluminum plate, and then wa...
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