Packaging structure of efficient light emitting diode light source
A light-emitting diode and packaging structure technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as low reflectivity, low luminous efficiency, and poor control of light color temperature, and achieve high luminous efficiency and increase luminous efficiency , cost reduction effect
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Embodiment 1
[0030] refer to figure 1 , figure 2 , a packaging structure of a high-efficiency light-emitting diode light source, comprising a base 1 of square structure aluminum-plated or mirror-surfaced aluminum, a chip packaging area 11 arranged on the base 1, and a cover layer 2 covering the base 1, The cover layer 2 and the base 1 are provided with a visible light high reflective material layer 3 except for the area corresponding to the chip packaging area 11. The cover layer 2 includes a first transparent sheet 21, a second transparent sheet 22 and a first The sealing fluorescent adhesive layer 23 between the transparent sheet 21 and the second transparent sheet 22 .
[0031] The visible light high reflective material layer is a silver-plated layer, and the visible light high reflective material layer 3 is plated on the bottom surface of the second transparent sheet 22 .
[0032] The working process of the packaging structure of a high-efficiency light-emitting diode light source ...
Embodiment 2
[0036] This embodiment is roughly the same as Embodiment 1, refer to image 3 , Figure 4 , just change the square base 1 into a strip base.
Embodiment 3
[0038] This embodiment is roughly the same as embodiment one and embodiment two, refer to Figure 5 , only the cover layer and visible light high reflective material layer are reduced, and this structure is used for blue light and ultraviolet light LEDs to form blue light and ultraviolet light.
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