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Packaging structure of efficient light emitting diode light source

A light-emitting diode and packaging structure technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as low reflectivity, low luminous efficiency, and poor control of light color temperature, and achieve high luminous efficiency and increase luminous efficiency , cost reduction effect

Inactive Publication Date: 2014-03-12
厦门宝晨照明科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The packaging structure of a high-efficiency light-emitting diode light source provided by the present invention aims to overcome the poor control of the light color temperature of the existing packaging structure of the light-emitting diode light source, the low reflectivity of the wavelength below 0.455um, and the low light emission. The disadvantage of low efficiency

Method used

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  • Packaging structure of efficient light emitting diode light source
  • Packaging structure of efficient light emitting diode light source
  • Packaging structure of efficient light emitting diode light source

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] refer to figure 1 , figure 2 , a packaging structure of a high-efficiency light-emitting diode light source, comprising a base 1 of square structure aluminum-plated or mirror-surfaced aluminum, a chip packaging area 11 arranged on the base 1, and a cover layer 2 covering the base 1, The cover layer 2 and the base 1 are provided with a visible light high reflective material layer 3 except for the area corresponding to the chip packaging area 11. The cover layer 2 includes a first transparent sheet 21, a second transparent sheet 22 and a first The sealing fluorescent adhesive layer 23 between the transparent sheet 21 and the second transparent sheet 22 .

[0031] The visible light high reflective material layer is a silver-plated layer, and the visible light high reflective material layer 3 is plated on the bottom surface of the second transparent sheet 22 .

[0032] The working process of the packaging structure of a high-efficiency light-emitting diode light source ...

Embodiment 2

[0036] This embodiment is roughly the same as Embodiment 1, refer to image 3 , Figure 4 , just change the square base 1 into a strip base.

Embodiment 3

[0038] This embodiment is roughly the same as embodiment one and embodiment two, refer to Figure 5 , only the cover layer and visible light high reflective material layer are reduced, and this structure is used for blue light and ultraviolet light LEDs to form blue light and ultraviolet light.

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Abstract

A packaging structure of an efficient light emitting diode light source comprises an aluminizing substrate or a mirror aluminum substrate, a chip packaging area arranged on the substrate and a covering layer covered on the substrate. Visible light high-reflecting material layers are arranged at the positions between the covering layer and the substrate except an area corresponding to the chip packaging area. The covering layer comprises a first transparent piece, a second transparent piece and a sealing fluorescent glue layer arranged between the first transparent piece and the second transparent piece. The substrate is an aluminum-coated structure, has high reflectivity to wavelength less than 0.46 mum and improves light emitting efficiency of the section of wavelength. Simultaneously, yellow light, green light and red light excited by fluorescent powder have high reflectivity in the visible light high-reflecting material layers, and the light emitting efficiency of a white-light light emitting diode (LED) can be improved remarkably by adopting the packaging structure with a substrate area and a covering layer area.

Description

technical field [0001] The invention relates to the field of lighting equipment, and more specifically refers to a packaging structure of a high-efficiency light-emitting diode light source. Background technique [0002] Such as Figure 6 Shown is the relationship between the wavelength and reflectivity of the silver-coated layer and the aluminum-coated layer, such as Figure 7 Shown is the relationship between the emission wavelength and the reflectance of the gold-plated layer. refer to Figure 6 , Figure 7 , when red light or infrared light-emitting diodes were invented, the industry used gold-plated brackets as bases. Since the light-emitting wavelength is above 0.6um, it is applicable. High-brightness red light diode chips are also gold-plated. It is a reflective surface; since the wavelength of visible green light, yellow-green light, yellow light, and orange light-emitting diodes is 0.5-0.6um, if a gold-plated bracket base is used, the reflectivity is low, and a si...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/60H01L33/50
Inventor 林威谕
Owner 厦门宝晨照明科技有限公司