Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Anisotropic conductive film

An anisotropic, conductive film technology, applied in conductive adhesives, conductive materials dispersed in non-conductive inorganic materials, modified epoxy resin adhesives, etc., can solve problems such as deterioration of basic electrical properties

Active Publication Date: 2012-07-04
KUKDO ADVANCED MATERIALS CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This coloration helps to confirm the presence of the film after pre-pressing, but can deteriorate the basic electrical properties of the film, including bond strength, wiring resistance, and insulation resistance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Anisotropic conductive film
  • Anisotropic conductive film
  • Anisotropic conductive film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] Example 1: Preparation of anisotropic conductive film

[0072] 30g solution (25vol%) of acrylonitrile butadiene rubber (weight average molecular weight=30000000g / mol) in toluene / methyl ethyl ketone (2:1 (v / v)), 15g bisphenol A type epoxy Resin, 33g of bisphenol A type epoxy acrylate resin, 5g of phosphoethyl (meth)acrylate, 1g of lauroyl peroxide, 1g of benzoyl peroxide, 8g of nickel with an average particle size (D50) of 5 μm The particles were blended with 1 g of copper-chromium oxide (Black 30C965, Shepherd) to prepare an anisotropic conductive film composition. This composition was coated on a polyethylene terephthalate film as a release film, and dried to prepare an anisotropic conductive film having a coating thickness of 35 μm.

Embodiment 2～7

[0073] Examples 2-7: Production of anisotropic conductive film

[0074] An anisotropic conductive film was produced in the same manner as in Example 1, except that the content and / or type of each component was changed as shown in Table 2.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Weight average molecular weightaaaaaaaaaa
Login to View More

Abstract

The present invention discloses an anisotropic conductive film. The anisotropic conductive film comprises preset amount of color composite inorganic pigment (CICP). The CICP causes easy confirmation for existence of the anisotropic conductive film after the film is pre-compressed on a circuit component without electric performance deterioration or thermal performance deterioration of the film.

Description

technical field [0001] The present invention relates to an anisotropic conductive film. More particularly, the present invention relates to an anisotropic conductive film comprising a colored composite inorganic pigment (CICP) which makes it easy to confirm the properties of the anisotropic conductive film after pre-pressing the film to a circuit element such as a PCB. exist without degrading the electrical and thermal properties of the film. Background technique [0002] The anisotropic conductive film refers to a film-like adhesive in which conductive particles such as metal particles or metal-coated plastic particles are dispersed. Anisotropic conductive films are widely used in various fields including circuit connection in the field of flat panel displays and component assembly in semiconductor devices. When the anisotropic conductive film is inserted between the circuits to be connected, followed by hot pressing under suitable temperature, pressure and time condition...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J163/10C09J7/00C09J9/02
CPCC08J5/18C08L101/12C09J7/22C09J2203/00C09J2301/314C09J2301/408C09J2301/50H01B1/20
Inventor 徐贤柱南宫贤熺申炅勋尹康培朴憬修金奎峰黄慈英
Owner KUKDO ADVANCED MATERIALS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com