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Manufacturing method for microstructure and microstructure

A technology of microstructure and light-curing materials, which is applied in the coupling of optical waveguides, microlithography exposure equipment, and photolithography exposure equipment, etc.

Inactive Publication Date: 2014-05-28
FAR EASTERN NEW CENTURY COPRRATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to overcome the defects in the existing methods of making microstructures, and provide a novel method of making microstructures. The technical problem to be solved is to make it easy to manufacture microstructures, and it is a non-contact method. process, so there will be no environmental pollution, foreign matter residue and other problems, very suitable for practical use

Method used

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  • Manufacturing method for microstructure and microstructure
  • Manufacturing method for microstructure and microstructure
  • Manufacturing method for microstructure and microstructure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] Mix 0.4g of a photocurable compound with multiple functional groups (KYOEISHA, model PE4A, acrylate series, functional group equivalent of 88g / mol), 0.6g of toluene and 0.02g of photoinitiator (Ciba, I-184, USA) 1.02 g of photocurable slurry with a solid content of 40%. The slurry was dropped on the polyester substrate (Toyobo, Japan, model A4300, 5cm×5cm×100μm), and the coating solution was evenly flattened by the spin coating method (Spin Coating, 500rpm, 40 seconds), and the coated The substrate 21 of the slurry is placed in an oven with a constant temperature of 80°C, baked for 3 minutes to remove the solvent, then moved to an oven with a constant temperature of 100°C, baked for 2 minutes for heat treatment, and finally returned to room temperature to form a solid surface on the substrate 21 A photocurable material layer 22 with a film thickness of 4.65 μm is formed above. Cover the photocurable material layer 22 with a linear patterned shielding layer 31 with a li...

Embodiment 2-5

[0059] As shown in Table 1, except that the functional group equivalents of the photocurable compound having multiple functional groups in the photocurable material layer 22 are different, other conditions for preparing the microstructures of Examples 2-5 are the same as those of Example 1. The functional group equivalents of the photocurable compounds with multiple functional groups used in Examples 2-5 are 96.3 (manufacturer is Cognis, model is 4600), 99.3 (manufacturer is Sartomer, model is SR444), 132 (manufacturer is Cognis, Model 4172F) and 400 (manufacturer is Sartomer, model is CN9006). The Rz values ​​of Examples 2-5 measured by a probe-type surface analyzer (manufactured by KOSAKA, Japan, model ET-4000A) are 2.74 μm, 2.63 μm, 0.41 μm, and 0.21 μm, respectively.

Embodiment 6-7

[0061] As shown in Table 1, except that the dose of the first ultraviolet light irradiation is different, other conditions for the preparation of the microstructures of Examples 6 and 7 are the same as those of Example 1. Embodiment 6 and 7 used first ultraviolet light irradiation dosage is respectively 350mJ / cm 2 with 100mJ / cm 2 . The Rz values ​​of Examples 6 and 7 measured by a probe-type surface analyzer (manufactured by KOSAKA, Japan, model ET-4000A) are 2.88 μm and 1.17 μm, respectively.

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Abstract

The invention provides a manufacturing method for a microstructure and the microstructure. The method comprises the following steps: a light-curing material layer is arranged on a base material; a patterning masking layer is provided; a first light source passes through the patterning masking layer, so that the light-curing material layer is locally exposed in a patterning manner, the exposure area of the light-curing material layer is subjected to curing reaction, and accordingly, the light curable composition in the unexposed area of the light-curing material layer moves towards the exposure area, so that the light-curing material layer is formed into a patterning microstructure with a raised curing area and a concave non curing area; and the microstructure is further subjected to curing, wherein the light curable composition in the concave non curing area of the photo-curing material layer is subjected to curing, so that the concave non curing area is formed into a concave curing area. According to the invention, the microstructure is prepared in a non-contact manner rather than a physical or chemical contact manner with the aid of devices or medicament.

Description

technical field [0001] The invention relates to a method for manufacturing microstructures, in particular to a method for preparing microstructures using non-physical or non-chemical contact methods. Background technique [0002] Microstructures can be applied to optoelectronic devices, such as displays, touch panels, sensors, electronic paper, optical components, and integrated circuit components. [0003] Generally known existing methods for fabricating microstructures include photolithography, thermal embossing, or mechanical processing. These traditional manufacturing methods are all contact processes, and more or less all have some disadvantages. [0004] For example, the photolithographic etching method (chemical contact method), such as US Pat. No. 6,036,579, has an expensive etching solution and has environmental pollution problems. [0005] In addition, the thermal embossing method (physical contact method), such as Taiwan patent I222925, is likely to affect the p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20B81B7/04G03F7/004G03F7/027
Inventor 邱大任洪维泽林士越陈秋芳陈姿颖
Owner FAR EASTERN NEW CENTURY COPRRATION