Method for utilizing base metal catalytic ink to manufacture printed circuit

A technology for catalyzing inks and printed circuits, applied to printed circuit components, inks, metal pattern materials, etc., can solve problems such as high costs, and achieve the effects of reduced manufacturing costs, good electrical conductivity, and low resistivity

Inactive Publication Date: 2012-07-11
SEMITEL ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a method for making printed circuits by using base metal catalytic inks, aiming at solving the high cost problem caused by using precious metal inks to make printed circuits at present, and developing a method for making printed circuits by using base metal inks. cut costs

Method used

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  • Method for utilizing base metal catalytic ink to manufacture printed circuit
  • Method for utilizing base metal catalytic ink to manufacture printed circuit
  • Method for utilizing base metal catalytic ink to manufacture printed circuit

Examples

Experimental program
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Embodiment

[0087] Embodiment: A kind of method that utilizes base metal catalytic ink to make printed circuit

[0088] The base metal catalytic ink is uniformly formed by stirring and mixing raw materials in a certain proportion.

[0089] Table 2: be the raw material formula (numerical unit: weight %) of embodiment 1~10 base metal catalytic printing ink

[0090]

[0091]

[0092] Embodiments 1-10 The method for making printed circuit: According to the raw material formula in Table 2, first dissolve the organic carrier in the organic solvent, then add functional materials and additives, fully stir and disperse evenly, and obtain the base metal catalytic ink.

[0093] When making a printed circuit, use the screen printing method to print a base metal catalytic ink circuit with a width of 0.4 mm and a length of 1 meter on the PET film, then put it in a 150-degree oven to dry for 60 minutes, and then perform electroless plating: put the dried item Put it into a copper sulfate solution...

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Abstract

The invention provides a method for utilizing base metal catalytic ink to manufacture a printed circuit. The method is characterized in that: the ink mainly is composed of 10% to 90% of functional materials, 2% to 18% of organic carriers and 8% to 72% of organic solvents, wherein the functional materials are formed by metal or / and metal oxide powder, the metal is one selected from the group of iron, nickel, aluminum, and zinc, or a mixture of at least two metals in random mixing proportion selected from the group of iron, nickel, aluminum, zinc, and copper, and a metal oxide is selected from ferrous oxide or / and cuprous oxide. According to the invention, traditional printing modes of screen printing, gravure printing and the like can be employed to manufacture lines on insulation base material, and then the insulation base material is put into a replacement reaction solution for a displacement reaction to form a conductor printed circuit. The method has the following advantages: (1) the ink does not contain precious metals of silver, gold and the like, and manufacture cost of related products is greatly reduced; (2) the method is simple; (3) the manufactured printed circuit is reliable, electric conductivity is good, and application is wide.

Description

technical field [0001] The invention relates to a method for making a printed circuit, in particular to a method for making a printed circuit by using base metal catalytic ink. The base metal catalytic ink replaces the traditional ink containing silver, gold, platinum, palladium and other precious metals, and can make various low-cost printed circuits on insulating substrates. Background technique [0002] At present, printed circuits are widely used in products or components such as membrane switches, electronic labels, touch screens, printed circuit boards, and flexible circuit boards. Usually, the production method of printed circuit is to print conductive ink (or conductive paste) on the insulating substrate by traditional printing methods such as screen printing and gravure printing, and then cure it at medium and low temperature, so that the insulating A printed circuit is formed on the substrate. However, the above-mentioned conductive inks used all contain precious...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/10H05K1/09C09D11/10C09D11/102C09D11/103C09D11/104C09D11/106C09D11/107
Inventor 冯波
Owner SEMITEL ELECTRONICS
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