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Polyamide compound and epoxy resin composition containing same

A technology of epoxy resin and compound, which is applied in the field of epoxy resin composition, can solve the problems of reduced tensile strength of resin, no material found, reduced linear expansion, etc., and achieve the effect of high peel strength

Inactive Publication Date: 2014-06-25
ADEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in order to increase the peel strength, there is a method of adding a filler to the resin to reduce the linear expansion, but when the amount of the filler is increased, there is a problem that the tensile strength of the resin decreases
Therefore, although it is necessary to reduce the linear expansion without increasing the blending amount of the filler, such a material has not yet been found

Method used

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  • Polyamide compound and epoxy resin composition containing same
  • Polyamide compound and epoxy resin composition containing same
  • Polyamide compound and epoxy resin composition containing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0047] Hereinafter, the present invention will be described in further detail through synthesis examples and examples, but the present invention is not limited to these synthesis examples and examples.

Synthetic example 1

[0048] [Synthesis Example 1] Synthesis of a polyamide compound having a structure of PA-1

[0049] 39.7 g (0.16 mol) of 3,3'-diaminodiphenylsulfone was dissolved in 160 g of N-methylpyrrolidone (hereinafter referred to as NMP) and 30.3 g of pyridine. 32.5 g (0.16 mol) of isophthaloyl chlorides were dissolved in 64 g of NMP, and were dripped at the said solution at the temperature of -15-0 degreeC.

[0050] The reaction was carried out at -15 to 0° C. for 2 hours, and then at room temperature for 2 hours. It was reprecipitated with about 2 liters of ion-exchanged water, filtered, and dried under reduced pressure at 150° C. for 3 hours to obtain 50 g (yield 83%) of a white powder (implemented polymer PA-1). From the infrared spectrum, it was confirmed that the obtained compound had an amide bond, and at the same time, a polymer having a mass average molecular weight of 11,800 was confirmed from the gel permeation chromatography image. In addition, the viscosity at 25° C. was 4...

Synthetic example 2～4

[0052] In the same manner as in Synthesis Example 1, the following polyamide compounds PA-2 to 4 were synthesized. The mass average molecular weight and viscosity of the obtained polyamide compound are as follows.

[0053] PA-2:

[0054] Mass average molecular weight: 5970,

[0055] Viscosity: 200mPas (25°C, 30 mass% NMP solution)

[0056] PA-3:

[0057] Mass average molecular weight: 13540,

[0058] Viscosity: 525mPas (25°C, 30% by mass NMP solution)

[0059] PA-4:

[0060] Mass average molecular weight: 50370,

[0061] Viscosity: 2500mPas (25°C, 30% by mass NMP solution)

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Abstract

Disclosed is a polyamide compound which is characterized by having a partial structure that is represented by general formula (I) and / or general formula (I') in a repeating unit. (In the formulae, X represents a hydrogen atom or a hydroxyl group.) Also disclosed is an epoxy resin composition which uses the compound as a curing agent. The polyamide compound is capable of providing an epoxy resin with high peel strength with respect to a surface that has low surface roughness, without increasing the amount of a filler blended therein.

Description

technical field [0001] The present invention relates to a novel polyamide compound and an epoxy resin composition containing it, especially a novel polyamide compound having a specific structure in a repeating unit, and a build-up insulating material suitable for a build-up type insulating material containing it epoxy resin composition. Background technique [0002] Epoxy resin, because of its excellent insulation, dimensional accuracy, and strength, has been widely used in printed wiring boards in the past, especially for the production of hardened products with high glass transition temperature, low linear expansion coefficient, and flexibility. From a viewpoint, it has been proposed to use a polyamide compound having a phenolic hydroxyl group as a curing agent (Patent Document 1). [0003] On the other hand, in the development of finer printed circuit boards, since there is a tendency to reduce the surface roughness of printed circuit boards, in recent years, a thermoset...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G69/32C08K5/5399C08K7/18C08L63/00C08L77/10C08K3/36
CPCC08K3/36C08L77/10C08K5/5399C08G59/44C08L81/06C08L63/00C08G69/42C08L2666/20C08L2666/22C08G69/32C08J3/20C08K3/016C08K5/49
Inventor 齐尾佳秀高畑义德森贵裕柏崎史
Owner ADEKA CORP