Substrate heating device

A heating device and substrate technology, applied in ion implantation plating, gaseous chemical plating, coating and other directions, can solve the problems of uneven temperature and long time, and achieve the advantages of improving heating uniformity, low cost and avoiding pollution. Effect

Active Publication Date: 2012-07-25
INST OF ELECTRICAL ENG CHINESE ACAD OF SCI +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to overcome the deficiencies of the prior art in s

Method used

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Embodiment Construction

[0031] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0032] The substrate heating device of the present invention mainly includes a box body and a substrate carrier heating frame.

[0033] The shape of the box body is a square box, and its material is stainless steel.

[0034] Such as figure 1 , 2 As shown, a vacuum-tight door 22 for loading and unloading the substrate carrier is opened on a vertical surface of the box body, and an observation window 19 is provided on the vacuum-tight door 22 for observing the internal conditions of the heating device; the observation window 19 A magnetic force push rod 20 is housed in the below, and a magnetic steel 21 is housed on the magnetic force push rod 20; A substrate outlet vacuum valve 17 is installed on the other side of the box opposite to the vacuum-tight door 22 . A manual rotating handle 1 is installed on the vertical surface of the described c...

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Abstract

The invention relates to a substrate heating device which comprises a box body and a substrate carrier heating frame, wherein the substrate carrier heating frame is mounted in the box body; a plurality of slots are formed on the substrate carrier heating frame; the substrate carrier heating frame is mounted on two parallel guide rails and is capable of reciprocating along horizontal direction; a substrate needing to be heated is fixedly arranged on a substrate carrier through a fixing bolt and a substrate carrier slot; and then the substrate carrier is inserted into the slot of the substrate carrier heating frame and is heated. An electric heating method is adopted for heating in the substrate heating device and the substrate heating device is suitable for simultaneously heating substrates in batch.

Description

technical field [0001] The invention relates to a vacuum coating equipment, in particular to a heating device before substrate coating. Background technique [0002] The use of vacuum coating equipment is widely distributed in all walks of life. The heating of the substrate before coating is very important. If the heating uniformity is poor, it will seriously affect the optical, electrical and physical properties of the coated or deposited film. Whether it is industrial equipment or research and development equipment, in order to achieve heating uniformity, the method of heating only a single substrate is basically adopted at a time, which is inefficient and inconvenient for continuous batch work. The heating principle of the substrate is mainly by infrared electromagnetic radiation. The substrate material itself plays a decisive role in the heating efficiency. If the heat capacity of the material is good, the heating efficiency will be high, otherwise it will be low. In ...

Claims

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Application Information

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IPC IPC(8): C23C16/46C23C14/22
Inventor 刁宏伟王文静赵雷周春兰李海玲
Owner INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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