Tin plating liquid with rear earth additive

A rare earth additive and tin plating solution technology, applied in the field of tin plating solution containing rare earth additives, can solve the problems of large porosity, affecting the quality of the coating, easy discoloration, etc., to suppress the formation of microcracks, improve corrosion resistance, chemical Affinity effect

Inactive Publication Date: 2012-07-25
吉安市荣泰电讯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, copper plating has several major disadvantages: large porosity, easy to change color in the air, and affects the corrosion resistance of the overall coating of the product
In order to overcome these shortcomings, the method of thickening the coating is often used, which is time-consuming and expensive, especially on the automatic copper foil electroplating line. Due to the fixed process program design, the coating often changes color before entering the next process, which affects the quality of the coating. quality

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0007] The present invention is achieved in this way, during electroplating, add the rare earth additive that accounts for 0.2% of tin plating liquid mass in the tin plating liquid, and rare earth additive is LaCl 3 .

Embodiment 2

[0009] The present invention is achieved in this way, during electroplating, add the rare earth additive that accounts for 0.3% of tin plating liquid quality in the tin plating liquid, and rare earth additive is Y 2 o 3 .

Embodiment 3

[0011] The present invention is achieved in this way, during electroplating, add the rare earth additive that accounts for 0.25% of tin plating liquid quality in the tin plating liquid, and rare earth additive is CeO 2 .

[0012] The tin plating solution can be 20 g / L of stannous chloride, 75 g / L of thiourea, 90 g / L of sodium hypophosphite, 80 g / L of hydrochloric acid, and 1 g / L of surfactant.

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PUM

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Abstract

The invention provides tin plating liquid with a rear earth additive. The rear earth additive, which is 0.2-0.3% of tin plating liquid in mass, is added in the tin plating liquid, and the rear earth additive comprises LaCl3, Y2O3 or CeO2. According to the technical effects provided by the invention, a proper amount of the rear earth additive is added, so that the higher current efficiency achieves a lower temperature, the micro-fractures is retained to form, and the corrosion resistance of the plated layer is improved. Meanwhile, the free increment amount of rear earth and lots of non-metal elements have larger negative values, so that the corresponding chemical affinities are strong. By adding rear earth ions in the plating liquid, the properties of the plating liquid in the traditional electroplating process can be effectively improved due to the activity of the rear earth elements.

Description

technical field [0001] The invention relates to a tin plating solution, in particular to a tin plating solution containing rare earth additives. Background technique [0002] At present, copper plating has several major disadvantages: large porosity, easy to change color in the air, and affects the corrosion resistance of the overall coating of the product. In order to overcome these shortcomings, the method of thickening the coating is often adopted, which is time-consuming and expensive, especially on the automatic copper foil electroplating line. Due to the fixed process program design, the coating often changes color before entering the next process, which affects the quality of the coating. quality. Adding rare earth additives for bright tin plating can reduce the porosity of the coating, improve the discoloration resistance and corrosion resistance of the coating, and especially have a very obvious effect on improving the overall corrosion resistance of the coating. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/30
Inventor 何荣贵代英何东霖颜鹏林申小孟李付军伍碧桃刘兵曹国良
Owner 吉安市荣泰电讯科技有限公司
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