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Light-emitting assembly

A technology of light-emitting elements and light-emitting stacks, which is applied to electrical components, semiconductor devices, circuits, etc., and can solve the problems of reduced luminous efficiency of the light-emitting component 100 and decrease in brightness of the light-emitting component 100

Active Publication Date: 2012-07-25
EPISTAR CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in the manufacturing process of the above-mentioned known light-emitting component 100, the high-temperature process easily causes the ohmic contact layer 15 to react with the low-refractive index layer 142 in the omni-directional reflective layer 14, resulting in a decrease in the brightness of the light-emitting component 100: In addition, for The metal ohmic contact point 144 provided to make the light-emitting component 100 have good electrical conductivity is easy to absorb the light emitted by the light-emitting layer 162, which also leads to a decrease in the luminous efficiency of the light-emitting component 100

Method used

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Embodiment Construction

[0039] Embodiments of the present invention are described below with reference to the accompanying drawings.

[0040] figure 2 It is a structural schematic diagram of an embodiment of the present invention, such as figure 2 As shown, the light-emitting component 200 includes a conductive substrate 20, an adhesive layer 22 disposed on the conductive substrate 20, an omni-directional reflective layer 24 (omni-directional reflector, ODR) located on the adhesive layer 22, and an omni-directional reflector located on the aforementioned omni-directional reflective layer 24. The first transparent conductive oxide layer 26, the light emitting stack 28 disposed on the first transparent conductive oxide layer 26; and the electrode 30 located on the light emitting stack 28; wherein, the omnidirectional reflective layer 24 and the first transparent conductive The oxide layer 26 further includes a transparent insulating barrier layer 32 , and the omnidirectional reflective layer 24 furt...

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Abstract

The invention discloses a light-emitting assembly, at least comprising a light-emitting laminated layer, a first transparent conductive oxide layer located below the light-emitting laminated layer, a transparent insulation barrier layer located below the first transparent conductive oxide layer, a second transparent conductive oxide layer located below the transparent insulation barrier layer, and a metal reflection layer located below the second transparent conductive oxide layer, wherein the metal reflection layer and the second transparent conductive oxide layer form an omni-directional reflector (ODR), and ohm contact is formed by the first transparent conductive oxide layer and the light-emitting laminated layer so as to increase the light-emitting efficiency of the light-emitting assembly.

Description

[0001] This application document is a divisional application of the No. 200810177820.2 patent application for invention filed on December 1, 2008 with the title of "light-emitting component". technical field [0002] The present invention relates to a light-emitting component, in particular to a light-emitting component structure with an insulating barrier layer (dielectric barrier layer) located between a first transparent conductive oxide layer and a second transparent conductive oxide layer. Background technique [0003] The light-emitting diode (light-emitting diode, LED) uses the energy difference between n-type semiconductors and p-type semiconductors to release energy in the form of light. This light-emitting principle is different from that of incandescent lamps. Principle, so light-emitting diodes are called cold light sources. In addition, light-emitting diodes have the advantages of high durability, long life, light weight, and low power consumption. Therefore, to...

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Application Information

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IPC IPC(8): H01L33/42H01L33/46
Inventor 林锦源杨雅兰
Owner EPISTAR CORP
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