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LED (Light-Emitting diode) multi-chip module and manufacturing method thereof

A LED chip and multi-chip technology, which is applied in the field of LED multi-chip modules and its production, can solve problems such as inability to fit tightly, loss of light energy, and unsatisfactory utilization of light energy, and achieve improved light efficiency and low light energy loss. The effect of reducing and avoiding the loss of light efficiency

Inactive Publication Date: 2014-08-20
杨然森 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Using the LED multi-chip module to directly distribute light through the astigmatism lens can form the rectangular light field required by the street lamp, but the existing LED multi-chip modules cannot be tightly attached to the solid lens body without gaps, resulting in LED multi-chip modules. With the light distribution lens, at least 20% of the light energy is lost due to the refraction of the air in the middle, and the light energy utilization rate is not ideal

Method used

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  • LED (Light-Emitting diode) multi-chip module and manufacturing method thereof
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  • LED (Light-Emitting diode) multi-chip module and manufacturing method thereof

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Embodiment Construction

[0025] The present invention will be further described below in conjunction with embodiment.

[0026] refer to Figure 1-4 , Embodiment 1 The LED multi-chip module mainly includes a copper substrate 1, a mounting frame 2, a plurality of LED chips 3 disposed in the mounting frame 2, phosphor silica gel 4, and a transparent silica gel layer 5, etc.

[0027] The surface of the copper substrate 1 is plated with a reflective layer. The reflective layer on the surface of the copper substrate 1 is a silver layer or a chrome layer, and the thickness of the reflective layer is 0.1-2um. A mounting hole 11 is opened near the edge of the copper substrate 1 .

[0028] The mounting frame 2 includes a frame 21 and a large stepped cavity with a large upper opening in the frame 21; the stepped cavity in the mounting frame 2 includes three parts: a lower cavity section 22, a middle cavity section 23 and an upper cavity section 24. An electrode sheet (shown in the figure) connected to the LED...

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Abstract

The invention provides an LED (Light-Emitting diode) multi-chip module which comprises a copper base plate with a reflecting layer, a mounting frame and a plurality of LED chips, wherein the mounting frame is fixedly arranged on the copper base plate and internally provided with a step-shaped through cavity; the lower cavity section of the step-shaped through cavity is combined with the surface of the middle part of the copper base plate to form a low cavity; the parts, adjacent to two borders, in the mounting frame are respectively provided with an electrode groove; the LED chips are arranged in the lower cavity of the mounting frame in longitudinal and horizontal directions, bound at the partial copper base plate at the bottom of the lower cavity and connected with electrode plates embedded in the mounting frame through gold wires; phosphor powder silica gel is distributed at the peripheries and tops of the LED chips; and the mounting frame is filled with a transparent silica gel layer on the phosphor powder silica gel layer, so that the LED multi-chip module can be seamlessly and tightly adhered to the flat bottom surface of a flat-bottom-surface solid lens. The LED multi-chip module is compact in structure and waterproof and has a protection grade higher than IP67; and a reflecting layer is sprayed on the inner surface of the step-shaped through cavity in the mounting frame and is matched with the reflecting layer on the surface of the copper base plate, so that the optical energy loss of an LED is greatly reduced.

Description

technical field [0001] The invention relates to the manufacturing technology of a light source assembly for high-power LED street lamps, in particular to an LED multi-chip module and a manufacturing method thereof. The LED multi-chip module and the solid lens body are tightly bonded without gaps to form a primary light source with a single lens, which can directly form the batwing rectangular light field required by the street lamp specification. Background technique [0002] At present, the light distribution of the rectangular light field of LED street lamps, whether it is a granular combination or a modular combination, the light distribution of the lens adopts multiple lenses or multiple lenses combined into one lens for light distribution, and some even use only The transparent body of the lower shell of the lamp is used as a light distribution lens. The reflection method of the lamp light source is the same as that of the traditional lamps, which follows the tradition...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075F21W131/103F21Y101/02F21Y115/10
Inventor 杨然森
Owner 杨然森