Method for preparing liquid refrigerator applied to semiconductor laser and refrigerating device thereof
A refrigeration device and refrigerator technology, applied in the direction of semiconductor lasers, lasers, laser parts, etc., can solve the problems of difficult processing, high production cost, low heat dissipation efficiency, etc., and achieve low production cost, low cost, and strong heat dissipation capacity Effect
Active Publication Date: 2012-08-01
FOCUSLIGHT TECH
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[0005] The invention provides a preparation method of a liquid cooler applied to a semiconductor laser to solve technical problems such as low heat dissipation efficiency, high processing difficulty, and high production cost in the prior art
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[0031] The present invention is described in further detail below in conjunction with accompanying drawing:
[0032] Such as figure 1 As shown, the base body 1 of the refrigerator of the present invention adopts a block-shaped body that has been ground on the main plane. First, an orifice 2 is opened above the refrigerator, and the base body of the refrigerator is hollowed out from the orifice 2 and a liquid channel is arranged inside. 3. A liquid inlet is provided on one side wall of the base body of the refrigerator, and a liquid outlet is provided on the other side wall, and the water inlet and the water outlet are connected with the liquid channel. Finally, open the opening 2 on the top of the refrigerator base 1 and seal it. The sealing method is to install the cover plate 6 or weld the cover plate 6 on the opening 2, so that the refrigerator base 3 with the cover plate 6 is installed from the outside. A complete whole, it is convenient to set the soldering layer to inst...
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The invention provides a method for preparing a liquid refrigerator applied to a semiconductor laser and a refrigerating device thereof and aims to solve the technical problems of low heat dissipation efficiency or high processing difficulty, high production cost and the like in the prior art. The method comprises the following steps: (1) forming an orifice above a refrigerator matrix and forming a cavity in the refrigerator matrix by the orifice; (2) fixedly arranging a heat dissipation assembly in the cavity by the orifice to form a liquid cooling passage, wherein the heat dissipation assembly has the following structural design basis that the heat dissipation area is increased as far as possible, the liquid cooling passage has a plurality of paths and the scale of turbulence of a cooling medium is improved; and (3) sealing the orifice formed above the refrigerator matrix. The liquid refrigerator has the advantages of strong heat dissipation capacity and low cost, is adjustable and facilitates arranging an anti-corrosion layer to improve the reliability.
Description
technical field [0001] The invention belongs to the field of semiconductor laser manufacturing, and relates to a method for preparing a liquid cooler applied to semiconductor lasers and a cooling device thereof, and is especially suitable for high-power semiconductor lasers. Background technique [0002] With the continuous improvement of output power, electro-optic conversion efficiency, reliability and performance stability of semiconductor lasers, high-power semiconductor lasers are more widely used in industry, medical treatment and military affairs, with huge market demand and broad development prospects. The performance of the laser is not only related to the chip, but also related to the heat dissipation and packaging of the laser. In order to improve the reliability and stability of the laser and reduce the production cost, an efficient heat dissipation structure must be designed. In addition, the design and manufacture of the packaging structure are required to be ...
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IPC IPC(8): H01S5/024
Inventor 刘兴胜宗恒军
Owner FOCUSLIGHT TECH