Clip type sheet LED patch structure and patch method thereof

A LED patch and pull-clip technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problem of stress and temperature field distribution, difficult selective bonding, difficult control of bonding area and thermal influence, etc. problems, to achieve the effect of being suitable for mass production, strong heat dissipation performance, and simple process

Inactive Publication Date: 2012-08-08
嘉兴晶兴湖电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, more and more researchers are working on LED sealing by using surface activation treatment and fused external auxiliary field strength, but they all need to be heated on the whole device or substrate, which will cause unnecessary stress and The temperature field distribution, and the above-mentioned sealing technology is not easy to achieve selective bonding, and the bonding area and heat-affected zone are difficult to control
At the same time, there is still a lot of room for improvement in the automation of the traditional single chip. It is also very important to greatly improve the light output efficiency of LEDs on the basis of solving the heat dissipation problem.

Method used

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  • Clip type sheet LED patch structure and patch method thereof
  • Clip type sheet LED patch structure and patch method thereof
  • Clip type sheet LED patch structure and patch method thereof

Examples

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Embodiment Construction

[0030] The present invention will be further described below in conjunction with the accompanying drawings.

[0031] Such as figure 1 Shown is a pull-clamp type thin-chip LED patch structure, including LED lamp beads 1 and two pieces such as figure 2 , image 3 In the shown pull-clip metal, the two pieces of pull-clip metal are recorded as the positive pull-clip metal 2 and the negative pull-clip metal 3 respectively; The negative pull-clamp metal 3 is clamped to form a Figure 4 Single strip clip-on LED assembly shown.

[0032] As shown in the figure, a single pull-clip LED component constitutes the simplest structure of a pull-clip sheet LED patch structure.

[0033] Such as figure 2 , image 3 The area on the clip-type metal used to clamp the LED lamp bead 1 is marked as the LED bonding area. On the opposite sides of the clip-type metal, one side is a smooth surface, and the other side is LED bonding area. The area is a groove; the base material of the clip-type me...

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Abstract

The invention discloses a clip type sheet LED patch structure and a patch method thereof. The LED patch structure comprises an LED bulb and two clip type metals, wherein the two clip type metals are marked as an anode clip type metal and a cathode clip type metal respectively, and two ends of the LED bulb are held by the anode clip type metal and the cathode clip type metal respectively to form a single clip type LED component. The clip type sheet LED patch structure provided by the invention has the characteristics of high luminous efficiency, strong heat dispersion, and certain flexibility and mechanical strength, and the clip type sheet LED patch method provided by the invention has the characteristics of simple process, capability of patching a plurality of LED wicks, and suitability for batch production.

Description

technical field [0001] The invention relates to an LED patching process, in particular to a clip-type chip LED patching structure and a patching method thereof, which can be applied to simultaneous patching of multiple LED lamp beads. Background technique [0002] Since light-emitting diodes are high-efficiency cold light-emitting elements that can convert electrical energy into light energy, and have the advantages of low power consumption and long life, light-emitting diodes are mostly used for indication purposes in electronic products. But how to use LEDs for commercial and home lighting or decoration still has a lot of space to be filled. [0003] Taiwan's new patent 1229948 discloses a flip-chip LED packaging array and its packaging unit. It mainly discloses that a LED chip is arranged on a ceramic substrate and connected to the metal wiring layer on the ceramic substrate; the ceramic substrate is made of Thermally conductive adhesive is attached to the cavity of a me...

Claims

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Application Information

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IPC IPC(8): H01L33/62H01L25/075H01L33/00
Inventor 高鞠王媛
Owner 嘉兴晶兴湖电子科技有限公司
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