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Dispensing process for LED (light-emitting diode) encapsulation

A technology for LED packaging and dispensing, which can be applied to devices, electrical components, circuits, etc. that apply liquid to the surface, and can solve problems such as increased cost, misalignment, and reduced packaging yield.

Inactive Publication Date: 2012-08-15
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, not all of the plurality of LED elements carried on the carrier board are good products that have been tested, and there must be defective products (NG products) such as black materials, off-lines, or misalignment of crystal grains.
When the defective product is not removed from the carrier plate, the dispensing equipment is still packaged in the usual procedure, so the packaging operation of the defective product will not only reduce the yield rate of the package, but also increase the cost, which should be worthy of attention and issues that need to be improved

Method used

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  • Dispensing process for LED (light-emitting diode) encapsulation
  • Dispensing process for LED (light-emitting diode) encapsulation
  • Dispensing process for LED (light-emitting diode) encapsulation

Examples

Experimental program
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Embodiment Construction

[0026] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0027] see figure 1 , is shown as a flow chart of the steps of the dispensing process of the LED package of the present invention, which includes the following steps:

[0028] S11 provides a carrier board to carry multiple LED components;

[0029] S12 provides a sensor to detect the LED elements on the carrier board, and make detection images and position parameters;

[0030] S13 sets the movement of the glue needle and the glue dispensing program, according to the detection image and position parameters;

[0031] S14 implement dispensing according to the movement of the glue needle and the dispensing procedure; and

[0032] S15 removing defective products on the carrier.

[0033] The step S11 provides a carrier board to carry a plurality of LED elements; the carrier board 10 includes a lead frame type, a ceramic chip compact type or a light bar type (Light bar),...

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PUM

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Abstract

The invention provides a dispensing process for LED (light-emitting diode) encapsulation, which comprises of the following steps of: providing a carrier board which carries a plurality of LED elements; providing a sensor which senses the LED elements on the carrier board and makes sensing images and position parameters; setting the movement of a dispensing needle and the dispensing process according to the sensed imaged and the position parameters; performing the dispensing according to the movement of the dispensing movement and the dispensing process; and removing bad products on the carrier board. According to the invention, the dispensing process is carried out according to the sensed imaged and the position parameter sensed by the sensor, thus the yield rate is improved and the cost is reduced.

Description

technical field [0001] The invention relates to a dispensing process for LED packaging, in particular to a dispensing process for LED packaging with a sensor for detection. Background technique [0002] The LED industry is one of the industries that has attracted the most attention in recent years. Up to now, LED products have the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free, and environmental protection benefits. However, in the process of LED packaging, a carrier board is used to carry multiple LED components, and then the dispensing equipment is used to drive the glue needles to package the LED components one by one in order to make the glue Needle-sprayed colloid covers the LED chip to complete the package. However, not all of the plurality of LED elements carried on the carrier board are good products that have been tested, and there must be defective products (NG products) such as black materials, off-li...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D1/26H01L33/00
Inventor 孔维江
Owner ZHANJING TECH SHENZHEN
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