Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Sealed electronic housing and sealed assembly method for the housing

An assembly method and housing technology, applied in the direction of electric solid devices, circuits, electrical components, etc., can solve the problems of complex devices, long manufacturing time, etc., and achieve the effects of no equipment, easy implementation, and excellent mechanical strength.

Inactive Publication Date: 2015-08-12
THALES SA
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the assembly of shells based on the formation of intermetallic compounds has the disadvantage that complex devices are required and the manufacturing time is long (several hours)

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sealed electronic housing and sealed assembly method for the housing
  • Sealed electronic housing and sealed assembly method for the housing
  • Sealed electronic housing and sealed assembly method for the housing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] figure 1 The overall parallelepiped of the first example of the housing according to the invention is shown in perspective to seal the exterior of the electronics housing 2 . The sealed electronics housing 2 comprises a support 3 and a cover 5 arranged to form a cavity 7 for housing electronic components 4 (these components are shown in figure 2 Middle) defines the wall, the electronic component 4 is fixed to the support 3 . The support 3 and the cover 5 are connected in a sealed manner by means of a joint 6 comprising clusters of metal nanoparticles. The group has a mesoscopic structure.

[0040] figure 2 schematically shows the figure 1 The cross-section of the shell in the vertical plane M. The electronics housing 2 comprises a cover 5 and a support 3 to which the electronic components 4 are fixed. exist figure 2 In the embodiment shown, the support 3 forms a base body which is generally flat-shaped. Furthermore, the support 3 has the function of a substra...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
sizeaaaaaaaaaa
sizeaaaaaaaaaa
Login to View More

Abstract

A method is provided for the sealed assembly of an electronic housing containing one or more electronic components. The method includes: assembling the housing by bringing a support, to which the electronic components are fixed, in contact with a cover by means of a mixture-including a paste and nanoparticles in suspension in the paste. The size of the nanoparticles range from 10 to 30 nm. The housing is closed in a sealed manner by heating the housing to a temperature T of between 150° C. and 180° C. making it possible to sinter the metal nanoparticles, while subjecting the housing to a pressure greater than 2.5×105 Pa.

Description

technical field [0001] The field of the invention relates to sealed electronic housings, the cavity inside of which houses at least one electronic component. The role of the housing is important because it directly affects the performance and reliability of the electronic functions performed by the electronic components it houses, as well as manufacturing cost and efficiency. The main function of the housing is to protect the electronic functions it contains from the external environment. The reliability of electronic components is sensitive to the gas present in the cavity and the relative humidity of said cavity. It is necessary to ensure the hermetic closure of the housing to protect the gas composition and relative humidity in the atmosphere, which is necessary for the correct operation of the packaged components (for example, when the housing is sealed, to avoid the ingress of hydrogen into the housing, hydrogen ingress can degrade chips made of gallium arsenide (GaAs)....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L23/10
CPCH01L21/50H01L2224/32225H01L2924/16251Y10T29/49146H01L2224/73265Y10T29/49147H01L2924/16195H01L2924/01322Y10T29/49144H01L2924/01327H01L2224/48227H01L23/10H01L2924/15192H01L2924/1461H01L24/73H01L2924/00012H01L2924/00
Inventor C·德勒冯O·旺迪耶W·贝纳塞
Owner THALES SA
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com