Working attaching chuck device and work piece laminating machine

Abstract

The invention provides a working attaching chuck device and a work piece laminating machine. By using the invention, attaching parts can be easily formed and a peeling part can be unitized, at the same time the peeling performance can be improved. In the invention, an installation protruding part (2c) of the peeling part (2) is clamped into a part between the side surface (3b) of a supporting member (3) and a clamping concave part (4a) of an ring-shaped part (4) in a manner that the installation protruding part can not move along the deformation direction towards the deformation part (2a). The attaching part (1) is connected to the outer edge of the deformation part (2a), and then is disposed on an installation surface (4a) of the ring-shaped part (4), thereby integrating the peeling part (2), the supporting member (3) and the attaching part (1) into one body by using the ring-shaped part (4). In addition, the deformation part (2a) and the attaching surface (1a) are adjacent to each other, and connected together, therefore, when the plate-shaped work piece (W) attached to the attaching surface (1a) by the deformation of the deformation part (2a), a larger peeling force can be obtained, and the flexure generated during the peeling process of the plate-shaped work piece (W) can be reduced to the minimal degree.

Description

technical field [0001] The present invention relates to a workpiece adhesion chuck device and a workpiece laminating machine provided with the workpiece adhesion chuck device. Adhering and holding glass substrates such as CF glass or TFT glass or synthetic resins made of plastic films such as PES (Poly-Ether-Sulphone) during the manufacturing process of flat-panel displays such as OLED) or plasma display (PDP) or flexible displays A substrate assembly device of a substrate laminating machine that manufactures and bonds plate-shaped workpieces such as substrates, or a substrate transfer device that is used to transfer workpieces (objects to be processed) such as insulators, conductors, or semiconductor wafers such as substrates. Background technique [0002] Conventionally, as such workpiece adhesion chuck devices and workpiece bonding machines, there have been substrate bonding devices that include the following requirements: a first chamber with a first flat plate on which ...

AI Technical Summary

Problems solved by technology

[0012] In particular, in order to adhere and hold the substrate in a vacuum state, it is necessary to vacuum-suction the spacer from the side of the support member to firmly adhere the two, so the surface of the support member will be more easily attached to the back of the spacer, and it is difficult to pass only the inside. Pressure rises to fully separate

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