Printed circuit board (PCB) of Bluetooth earphone

Abstract

The invention provides a printed circuit board (PCB) of a Bluetooth earphone. The PCB comprises a signal layer S1, ground layers G, a power layer P, a signal layer S2, a top layer, a bottom layer and a side edge, wherein the top layer and the bottom layer are grounded; the side edge is made of metal; the side edge is connected with the ground of the top layer and the bottom layer; and a grounded via is formed in the spare position of a connection position at which the side edge is connected with the ground of the top layer and the bottom layer. By the PCB of the Bluetooth earphone, the shortest path can be provided, so that static electricity can be rapidly conducted to each ground layer on the PCB, the energy of the static electricity can be weakened, and the tolerance of the Bluetooth earphone to electro-static discharge (ESD) can be effectively improved.

Description

technical field [0001] The invention relates to the technical field of bluetooth earphones, and more specifically, to a method for enhancing the electrostatic tolerance of a bluetooth earphone and a bluetooth earphone circuit board applying the method. Background technique [0002] Bluetooth is a short-range wireless communication technology with low cost and low power consumption. In recent years, with the popularization of Bluetooth products and wireless technology applications, Bluetooth headsets have become the most widely used Bluetooth technology in daily life. Through Bluetooth headsets, mobile phone users can realize wireless hands-free functions without having to start from the head like now. Hang a cord to the phone. [0003] Since static noise will affect the sound quality of the Bluetooth headset, the antistatic ability of the Bluetooth headset is one of the important factors to ensure its sound quality. [0004] figure 1 It is a schematic diagram of an intern...

AI Technical Summary

Problems solved by technology

[0005] Since the bluetooth headset circuit board itself is relatively small, and the electrostatic pulse energy is very large, if the electrostatic pulse energy cannot be absorbed as soon as possible by the shortest path, the original components in the bluetooth headset circuit board will be damaged, resulting in damage to the bluetooth headset product

[0006] Although each layer of the existing bluetooth headset circuit board is grounded, the top and bottom layers of the PCB are covered by solder mask, which is an insulating layer. After static electricity enters the product through the gap of the structural shell, it cannot be directly discharged to the ground. Parts discharge, which will cause damage to the parts, resulting in loss of function of the Bluetooth headset product

Images