Electrotype splicing method
An electroforming plate, electroforming technology, applied in the field of electroforming plate making
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Embodiment 1
[0035] c. Cut the nickel plate 1 of the unit nickel plate 1 with the holographic pattern affixed with the middle adhesive protective film 4 according to the same specification with a cutting knife to align any one of the opposite two sides 2-1, 2-2;
[0036] d. The cut edges of the four cut nickel plates 1 are manually spliced one by one, and the seams are tightly connected with adhesive tape on the above-mentioned intermediate adhesive protective film 4 to form a A unit group 6;
[0037] e. Put the connected unit group 6 on the platform with the back facing up, and paste all the nickel plate seams of the back unit with the special electroforming tape; tear off the middle-adhesive protective film 4 on the front;
[0038] f. Put the unit group 6 into the electroforming solution for electroforming connection; the thickness of the casting plate is required to reach more than 100um to ensure the connection strength of the plate seam;
[0039] g. The unit group 6 that has been e...
Embodiment 2
[0049] c. trimming any one of the relative two sides 2-1, 2-2 of the unit nickel plate 1 with the holographic pattern pasted with the middle adhesive protective film 4 according to the same specification with a cutting knife, such as figure 2 shown;
[0050] d. Carry out manual one-line splicing of the cut edges of the 4 pieces of the unit nickel plate 1 that have been cut, and use adhesive tape to tightly connect the seams on the above-mentioned medium-adhesive protective film 4, as shown in figure 2 Constitute a unit group 6;
[0051] e. Put the connected unit group 6 on the platform with the back facing up, and paste all the nickel plate seams of the back unit with the special electroforming tape; tear off the middle-adhesive protective film 4 on the front;
[0052] f. Put the unit group 6 into the electroforming solution for electroforming connection; the thickness of the casting plate is required to reach more than 100um to ensure the connection strength of the plate s...
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