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Processing method for enhancing lamination bonding force of rigid and flexible boards

A technology of soft and hard boards and processing methods, which is applied in the direction of assembling printed circuits with electrical components, which can solve problems such as delamination, failure to solve delamination problems, insufficient bonding force between soft boards and hard boards, etc., and achieve enhanced lamination The effect of bonding force and avoiding delamination of soft and hard boards

Active Publication Date: 2012-09-26
GUANGZHOU MEADVILLE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the surface of the protective film on the soft board is relatively smooth, it is easy to cause insufficient bonding force between the soft board and the hard board, resulting in delamination at the soft and hard joint during the subsequent uncovering process
Some manufacturers use various methods to roughen the surface of the soft board during production, but it still cannot solve the problem of delamination

Method used

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  • Processing method for enhancing lamination bonding force of rigid and flexible boards
  • Processing method for enhancing lamination bonding force of rigid and flexible boards
  • Processing method for enhancing lamination bonding force of rigid and flexible boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] In step A1, degreasing and cleaning are carried out at a temperature of 52°C and a pressure of 0.9 Bar, and the concentration of the inner bonded cleaning agent in the degreasing and cleaning solution is 85 mL / L;

[0043] In step A2, pickling is carried out at a temperature of 37°C and a pressure of 0.6 Bar. In the pickling solution, H 2 SO 4 Concentration 23mL / L, NaPS concentration 10g / L, Cu 2+ Concentration 20g / L;

[0044] In step A6, the activated presoak is carried out at a temperature of 37°C, and the concentration of the high-temperature material starter in the activated presoaked liquid is 17mL / L;

[0045] In step A7, the browning solution treatment is carried out at a temperature of 34°C; in the browning solution, the concentration of the inner layer bonding agent is 85mL / L, 50%H 2 O 2 Concentration is 19mL / L, H 2 SO 4 The concentration is 47mL / L, Cu 2+ Concentration 24g / L;

[0046] In step B, the plasma cleaning is carried out at a temperature of 80° ...

Embodiment 2

[0048] In step A1, degreasing and cleaning are carried out at a temperature of 51°C and a pressure of 0.6 Bar, and the concentration of the inner bonded cleaning agent in the degreasing and cleaning solution is 115mL / L;

[0049] In step A2, pickling is carried out at a temperature of 43°C and a pressure of 0.9 Bar. In the pickling solution, H 2 SO 4 Concentration 37mL / L, NaPS concentration 30g / L, Cu 2+ Concentration 10g / L;

[0050] In step A6, the activated presoak is carried out at a temperature of 43°C, and the concentration of the high-temperature material starter in the activated presoaked liquid is 23mL / L;

[0051]The browning solution treatment in step A7 is carried out at a temperature of 37°C; in the browning solution, the concentration of the inner layer bonding agent is 115mL / L, 50%H 2 O 2 Concentration is 24mL / L, H 2 SO 4 The concentration is 53mL / L, Cu 2+ Concentration 18g / L;

[0052] In step B, the plasma cleaning is carried out at a temperature of 100° ...

Embodiment 3

[0054] In step A1, degreasing and cleaning are carried out at a temperature of 51.5°C and a pressure of 0.8 Bar, and the concentration of the inner bonded cleaning agent in the degreasing and cleaning solution is 95mL / L;

[0055] In step A2, pickling is carried out at a temperature of 40°C and a pressure of 0.7 Bar. In the pickling solution, H 2 SO 4 Concentration 30mL / L, NaPS concentration 20g / L, Cu 2+ Concentration 15g / L;

[0056] In step A6, the activation pre-soaking is carried out at a temperature of 40°C, and the concentration of the high-temperature material starter in the activation pre-soaking solution is 20 mL / L;

[0057] The browning solution treatment in step A7 is carried out at a temperature of 35°C; in the browning solution, the concentration of the inner layer bonding agent is 100mL / L, 50%H 2 O 2 Concentration is 22mL / L, H 2 SO 4 The concentration is 50mL / L, Cu 2+ Concentration 25g / L;

[0058] In step B, the plasma cleaning is carried out at a tempera...

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Abstract

The invention discloses a processing method for enhancing lamination bonding force of rigid and flexible boards. The processing method comprises the following steps: A. carrying out brown treatment on a flexible board with a protective film; B. carrying out plasma cleaning treatment on the flexible board with the protective film; and C. carrying out typesetting lamination treatment on a rigid board and the flexible board with the protective film within eight hours. By adopting the processing method, the surface of the flexible board can achieve terrific roughening effect, thus enhancing the lamination bonding force of the flexible board with the rigid board and avoiding stratification of the rigid and flexible boards in the subsequent uncovering process.

Description

technical field [0001] The invention relates to a processing method for a rigid-flex board of a printed circuit board, in particular to a processing method for enhancing the lamination bonding force of a rigid-flex board. Background technique [0002] Rigid-flex boards have both the durability of rigid PCBs and the adaptability of flexible PCBs, and have good development potential in PCB applications. However, in the production process of rigid-flex boards, in order to meet the high-precision and high-density needs of circuit board production, manufacturers will add protective films on the surface of substrates and semi-finished boards to prevent pollution, oxidation and other problems that affect accuracy and density. For example, the utility model patent with application number 200920153238.2 discloses a protective film for rigid-flex boards; the invention patent with application number 200710084068.2 discloses a flexible printed circuit board with a protective film. Sin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/36
Inventor 张榕晨吴少晖陈建勋
Owner GUANGZHOU MEADVILLE ELECTRONICS
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