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Temperature measurement device and temperature measuring method

A technology of temperature measurement and measurement points, applied in the field of temperature measurement devices, to achieve the effect of high-depth temperature measurement

Active Publication Date: 2012-10-03
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, when the miniaturization of the temperature measuring part is further promoted, for example, the thermal balance between the side surface of the temperature measuring part and the environment (atmosphere) is very significant, so that the measurement error corresponding to the difference in thermal balance can no longer be ignored.
In this regard, there are undeniably slight measurement errors

Method used

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  • Temperature measurement device and temperature measuring method
  • Temperature measurement device and temperature measuring method
  • Temperature measurement device and temperature measuring method

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Experimental program
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no. 1 Embodiment approach

[0150] figure 1 (A)~ figure 1 (C) is a diagram for explaining the method of measuring the deep temperature in the first embodiment. exist figure 1 In , only the main part (temperature measuring part) of the temperature measuring device in this embodiment is described. In addition, we will use later Figure 8 An example of the overall configuration of the temperature measuring device will be described.

[0151] First, refer to figure 1 (A). The temperature measuring device in this embodiment has: a base material 40; a first temperature sensor 50 that measures the temperature at the first measurement point p1 of the base material 40 as the first temperature Tb; a second temperature sensor 52 that measures the temperature of the base material The temperature at the second measurement point p2 different from the first measurement point p1 of 40 is taken as the second temperature Tp; 3 temperature.

[0152] The substrate 40 has: a first surface SR1 which is a contact surfac...

no. 2 Embodiment approach

[0285] In this embodiment, a second calculation formula different from that of the above-mentioned embodiment is used as the calculation formula of the deep temperature. In addition, in this embodiment, temperature measurement (acquisition of temperature information) is performed at least twice.

[0286] Figure 17 It is a figure for demonstrating the measurement method of deep temperature in 2nd Embodiment. Such as Figure 17 As shown, in this embodiment, the first measurement and the second measurement are performed, and the ambient temperature (third temperature) Tout1 in the first measurement is different from the ambient temperature (third temperature) Tout2 in the second measurement.

[0287] Let the first temperature obtained in the first measurement be Tb1, the second temperature be Tp1, the third temperature be Tout1, the first temperature obtained in the second measurement be Tb2, the second temperature be Tp2, and the third temperature be Tout2 .

[0288] The ca...

no. 3 Embodiment approach

[0310] Next, an example of a method of providing the temperature sensor on the base material 40 will be described. Figure 21 (A)~ Figure 21 (E) is a figure for demonstrating an example of the method of providing a temperature sensor on a base material. Here, the first temperature sensor 50 (composed of, for example, a thermocouple element) will be described as an example. The method described below is also similarly applied to the second temperature sensor 52 and the third temperature sensor 55 .

[0311] Figure 21 (A) shows a plan view and a cross-sectional view of the substrate 40 (including the first temperature sensor 50 ). As shown in the plan view, the substrate 40 has a square shape in the plan view, and both the vertical Y1 and the horizontal X1 are 50 mm, for example. In addition, as shown in the cross-sectional view, the height Y3 of the base material is, for example, 5 mm. Furthermore, the first temperature sensor 50 is buried in the base material 40 . The ho...

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Abstract

A temperature measurement device includes a temperature measurement part (43), a calculation part (74), and a control part (73) for controlling the operation of the temperature measurement part and the calculation part; wherein the temperature measurement part has a substrate (40) having a first surface as a contact surface with a measured body, and a second surface as an environment-side surface which is opposite the first surface; a first temperature sensor (50); a second temperature sensor (52); and an environment temperature acquiring part (53); and the first temperature sensor and the second temperature sensor measure a first temperature and a second temperature a plurality of times under conditions in which a third temperature varies; and the calculation part calculates a deep temperature (Tc) in a deep part of the measured body, on the basis of a deep temperature calculation equation, by using the measured temperatures.

Description

technical field [0001] The present invention relates to a temperature measuring device, a temperature measuring method and the like. Background technique [0002] For example, based on body temperature as basic vital information, vital information such as health status, basal metabolic status, and mental status can be obtained. When estimating the health state, basal metabolic state, or mental state of a human or animal based on the body temperature of the human or animal, the temperature of the surface layer is not required, but the information of the deep temperature (deep temperature) is required. [0003] In addition, for example, in the case of measuring the internal temperature of a furnace or pipeline, if the internal temperature (that is, the deep temperature) can be measured by a temperature measuring device installed outside the furnace or pipeline, it is not necessary to install the temperature measuring device on the The internal engineering of the furnace or pi...

Claims

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Application Information

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IPC IPC(8): G01K7/00G01K13/00
CPCG01K1/165G01K13/002G01K7/42G01K13/20G01K7/427
Inventor 清水兴子
Owner SEIKO EPSON CORP