Encapsulation substrate with embedded passive components and manufacturing method thereof

Abstract

The invention provides a packaging substrate of an embedded passive assembly. The packaging structure comprises a core board, a dielectric layer unit, a positioning pad, a passive assembly, a first line layer and a second line layer. The core board is provided with an opening, and the dielectric layer unit wraps the core board, full-fills the opening of the core board, and is provided with an upper surface and a lower surface. The positioning pad is embedded in the lower surface of the dielectric layer unit. The upper surface and lower surface of the passive assembly are provided with a plurality of electrode pads, and the passive assembly is embedded in the dielectric layer unit, arranged in the opening of the core board, and corresponds to the positioning pad. The first line layer is arranged on the upper surface of the dielectric layer unit, and a first conducting blind hole is electrically connected between the first line layer and the electrode pads arranged on the upper surface of the passive assembly. The second line layer is arranged on the lower surface of the dielectric layer unit, and a second conducting blind hole is electrically connected between the second line layer and the electrode pads arranged on the lower surface of the passive assembly. The passive assembly is embedded in the core board and the dielectric layer unit, thereby effectively lowering the height of the overall structure.

Description

technical field [0001] The invention relates to a packaging substrate and a manufacturing method thereof, in particular to a packaging substrate with passive components and a manufacturing method thereof. Background technique [0002] With the evolution of semiconductor packaging technology, the demand for passive components is also increasing; passive components do not affect the basic characteristics of the signal, but only pass the signal without changing the circuit components, generally refer to capacitors, resistors, inductors three. compared to active components. Since passive components cannot participate in electronic movement, when the voltage or current changes, its resistance and impedance will not change accordingly, so it needs to be connected with active components to operate. [0003] All kinds of products that need to be driven by electricity need to use passive components to achieve the function of electronic circuit control. The application range include...

AI Technical Summary

Problems solved by technology

[0004] With the progress of science and technology, electronic devices are designed to be light, thin and short. However, the structure in which the passive components 12 are arranged on the substrate 10 in the prior art leads to an increase in the height of the overall packaging structure, which is not conducive to the thinness of the electronic device. Moreover, because the passive component 12 is arranged on the outer surface of the substrate 10, the signal transmission path between the inner circuit of the substrate 10 and the passive component is too long, which may easily lead to electrical loss and affect the electrical function.

In addition, because wiring is required on the surface of the substrate 10, the area where the passive components 12 can be placed is limited, resulting in a limited number of passive components 12. If it is necessary to add passive components 12, it will inevitably affect the wiring.

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