CPU (central processing unit) temperature detecting device and system for acquiring temperature of CPU by aid of CPU temperature detecting device

Abstract

The invention discloses a CPU (central processing unit) temperature detecting device and a system for acquiring the temperature of a CPU by the aid of the CPU temperature detecting device. The CPU temperature detecting device comprises one or a plurality of sensing modules, each sensing module comprises a combined fiber bragg grating sensing element, a miniature groove is arranged on each radiating fin base of the CPU, and the combined fiber bragg grating sensing elements are fixed into the miniature grooves, are cascaded with common optical fibers and then connected with each other by annular couplers to form a distributed optical fiber sensing array. The system further comprises super-radiation light emitting diodes, circulators, a demodulation module, a photoelectric conversion and information conditioning module, a signal processing module and a display module. The optical fiber sensing technology is creatively introduced into the field of test for radiating properties of servers, test for the radiating property of CPUs of multiple servers can be simultaneously completed in an online manner, test sample indexes capable of being completed are increased, testing period is shortened, and testing efficiency is improved.

Description

technical field [0001] The invention relates to a CPU temperature detection device and a system for obtaining the CPU temperature by using the device. Background technique [0002] Modern high-performance servers have made a qualitative leap in performance parameters such as system integration density and operating speed, and with the improvement of server performance indicators, its power consumption level has also increased accordingly. Therefore, it is necessary to adopt an effective control strategy to effectively evaluate the server power consumption level and heat dissipation indicators, and then guide the further optimized design of the developed products. [0003] Usually, in the process of developing a specific product or optimizing the designed product, the server manufacturer needs to conduct heat dissipation experiments on the CPU on the motherboard to evaluate whether the designed motherboard meets the heat dissipation test standard, which is helpful for the des...

AI Technical Summary

Problems solved by technology

[0007] These solutions have the following disadvantages: the electromechanical temperature sensors used in traditional CPU cooling test solutions have low resolution and slow response, and are difficult to detect small temperature changes; the data acquisition and analysis modules used have fewer channels, and server or PC manufacturers can only target Samples of some motherboards in a batch are sampled one by one, resulting in fewer samples collected, and it is difficult to fully present the power consumption performance of the same batch of motherboards to the R&D personnel; during the specific test process, each channel of the data acquisition module can only It is interconnected with a thermocouple sensor, and the test period for a batch of samples is long, which seriously affects the progress of the project; the electromechanical sensor for temperature detection is easily affected by the complex electromagnetic environment of the chassis, resulting in a certain deviation between the test data and the real value; the test During the process, testers need to participate in the whole process on site, and working in the special noise environment of the laboratory for a long time, the physical and mental health of testers cannot be effectively guaranteed

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