High-light-efficiency and high-thermal-conductivity LED COB light source packaging structure and manufacture process thereof

Abstract

The invention discloses a high-light-efficiency and high-thermal-conductivity LED COB (Chip On Board) light source packaging structure and a manufacture process thereof. The high-light-efficiency and high-thermal-conductivity LED COB light source packaging structure is characterized by comprising a metal heating panel and a thinner circuit board, wherein small round holes in preset shapes are formed on the circuit board; the metal heating panel and the thinner circuit board are combined together through pressing-in by high-thermal-conductivity glue; the bottoms of the small round holes in the preset shapes on the circuit board are glazed, and the inner walls of the small round holes are electroplated; circuits are arranged in a serial-parallel combined manner and welding wire positions are arranged on the circuits; all wafers are placed at solid crystal positions of the small round holes on the metal circuit board and connected with the welding wire positions on the circuit board through corresponding conducting wires; silica gel mixed with fluorescent powder is sealed on the wafers and the conducting wires and in the small round holes of the circuit board in a point-protruding manner; and the bottom of the metal heating panel can be jointed with a radiator through heat conducting glue so as to take a better radiating effect.

Description

technical field [0001] The present invention relates to an LED COB light source packaging structure with high light efficiency and high thermal conductivity and a manufacturing process thereof, and more specifically relates to a LED COB light source packaging structure with good heat dissipation performance, high luminous efficiency and strong luminous brightness and a manufacturing process thereof. Background technique [0002] Compared with traditional light sources, LED lights have the characteristics of long life, high luminous efficiency, low power, and low energy consumption. In recent years, the rapid development of white LED is gradually entering the field of general lighting. The current popular LED COB light source in the market is either the chip is fixed on the copper platinum of the aluminum substrate, which has a poor heat dissipation effect; Putting them together and connecting them together, this kind of long-time lighting and heat accumulation effect reduce...

AI Technical Summary

Problems solved by technology

The current popular LED COB light source in the market is either the chip is fixed on the copper platinum of the aluminum substrate, which has a poor heat dissipation effect; Put together and wire together, this kind of long-time lighting heat accumulation effect reduces light efficiency and shortens lifespan

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