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One-dimensional nano welding flux for micron/nanoscale welding and preparation method thereof

A nano-scale, nano-welding technology, used in welding equipment, welding equipment, welding/cutting media/materials, etc., to achieve the effects of low toxicity, good thermal conductivity, good wettability and diffusivity

Inactive Publication Date: 2012-11-14
LANZHOU UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this kind of solder can only be used for micron scale, not for nanoscale soldering

Method used

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  • One-dimensional nano welding flux for micron/nanoscale welding and preparation method thereof
  • One-dimensional nano welding flux for micron/nanoscale welding and preparation method thereof
  • One-dimensional nano welding flux for micron/nanoscale welding and preparation method thereof

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preparation example Construction

[0042] attached Image 6 For using the 150 nanometer diameter Sn of the preparation of the present invention 99 Au 1 Nanowire solder welding process of "herringbone" nanopattern composed of 50 nm diameter gold nanowires: (a) use nanomanipulator to extract 55 nm gold nanowires, assemble unconnected "herringbone" nanopattern scanning electron microscope (SEM ) diagram; (b) the nano controller extracts a single 150nm Sn99Au1 nanowire solder and places it on the part to be soldered, and puts the nanoprobe tightly on both ends of the one-dimensional nanosolder SEM image; (c) connects the power supply to make the Sn99Au1 nanowire The wire solder is electrically melted quickly through 120% of the maximum withstand current, and the molten nano-solder is cooled and solidified to weld the discrete "herringbone" characters into a high-conductivity overall SEM image.

[0043] attached Figure 7 In order to use the prepared nano-solder of the present invention to detect the quality of n...

Embodiment 1

[0047] Example 1—Sn 78 Ag 22 Preparation of Nanowire Solder

[0048] 1a) Selection of template: Anodized alumina with a pore size of 3-400 nanometers and a thickness of 10 nanometers to 150 microns is used as the template. This alumina can be a commercial product. If it is difficult to purchase commercial porous alumina, it can be prepared by itself. Specifically The preparation method has been reported in the prior art.

[0049] 1b) Preparation of electroplating solution: 0.18 mol / L stannous methanesulfonate + 0.001 mol / L silver iodide + 0.60 mol / L potassium pyrophosphate + 2.0 mol / L potassium iodide + 0.4 mol / L triethanolamine + 5 g / L ascorbic acid + 1g / L hydroquinone.

[0050] 1c) Electrochemical deposition:

[0051] Use the polycarbonate template or porous anodized aluminum template (the barrier layer has been removed) that has already been crossed (the electrode can be any conductive metal such as copper, silver, gold, platinum, etc.) as the cathode, and the graphite ...

Embodiment 2

[0059] Example 2—Sn x Au y Preparation of Nanowire Solder

[0060] 2a) Selection of templates:

[0061] ditto

[0062] 2b) Preparation of electroplating solution:

[0063] Two plating solutions can be used:

[0064] Plating solution 1: 100 g / L ammonium tricitrate + 5 g / L gold chloride + 9 g / L tin chloride + 60 g / L sodium sulfite + 10 g / L gelatin + 5 g / L ascorbic acid

[0065] Plating solution 2: 0.5 mol / L tin chloride + 5 g / L gold chloride + 10 g / L gelatin + 5 g / L ascorbic acid + 0.01 mol / L hydrochloric acid

[0066] 2c) Electrochemical deposition:

[0067] Use a commercial electrochemical workstation, adopt a three-electrode system, and use a polycarbonate template or a porous anodized aluminum template (the barrier has been removed layer) as the working electrode, Ag / AgCl or Hg / HgCl 2 The electrode is the reference electrode, and the platinum electrode is the counter electrode. Compared with the reference electrode -1800mV deposition potential, use one of the above ...

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Abstract

The invention discloses one-dimensional nano welding flux for micron / nanoscale welding and a preparation method of the one-dimensional nano welding flux for micron / nanoscale welding. The one-dimensional nano welding flux disclosed by the invention is a metal nanowire or an alloy nanowire, the diameter of which is 3-400 nanometers. The preparation method of the welding flux disclosed by the invention comprises the steps of: first, taking a microporous material which is 3-400 nanometers in pore diameter and dozens of nanometers to 150 microns in thickness as a moldboard; depositing corresponding metal wires or alloy wires in nanopores of the moldboard in a metal ion electrolyte corresponding to components of the prepared welding flux through an electrochemical method; then dissolving the moldboard material by a solution that dissolves the moldboard material but not dissolves alloy in the nanopores of the moldboard so that the metal nanowires or alloy wires in the nanopores of the moldboard are released and dispersed to the solution; and then cleaning and filtering various salt components in the system, and dispersing the metal nanowires or alloy wires in deionized water for future use.

Description

technical field [0001] The invention relates to the field of solder materials, in particular to one-dimensional nano-solder for micro / nano-scale welding and a preparation method thereof. Background technique [0002] With the current in-depth development of nanomaterials research, people have been able to easily prepare thousands of nanomaterials through various physical, chemical or biological methods. Single nanomaterials or nanodevice units are welded together and connected into various nanoelectronic devices, sensors, devices, equipment and tools with special functions and effects. The reason is that the welding tools and solder used in the welding process in modern welding technology are much larger than the size of nano-materials, which cannot completely cover the nano-welding matrix, and cannot match at all in size. At present, modern welding technology and various nano-welding technologies that can weld nano-scale monomer materials or device units together in the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/02B23K35/22B23K35/40B23K31/02
Inventor 彭勇张宏贝芙莉·尹格申托尼·卡力斯
Owner LANZHOU UNIVERSITY