Degumming method of printed circuit board

A technology for printed circuit boards and baked boards, which is applied in the field of circuit board manufacturing, and can solve problems affecting quality, unclean removal of glue in plated through holes, resin shrinkage, etc., to meet quality requirements and reduce copper-free effects

Active Publication Date: 2012-11-28
KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under the existing glue removal process, some boards (such as high glass transition temperature Tg boards used in lead-free assembly, halogen-free flame retardant boards, and high-filler boards, etc.) appear to be plated through in the case of one-time overdrawing. Poor glue removal defects such as dirty hole removal or resin shrinkage exceed IPC acceptance standards or customer standards, seriously affecting quality problems

Method used

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  • Degumming method of printed circuit board
  • Degumming method of printed circuit board
  • Degumming method of printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The deglue method of embodiment 1PCB circuit board

[0020] The PCB circuit board sheet material in this embodiment is GA-170-LL sheet material, and this GA-170-LL sheet material is the material with high Tg (170 ℃), low Z-axis expansion coefficient, is used for the lead-free manufacturing process PCB process. In this embodiment, the various raw materials used in the pre-degumming process and the degumming process are all conventionally used raw materials in the art, such as the expansion liquid is mainly ethylene glycol monobutyl ether (40-60%) and hydrogen Sodium oxide solution, the main function of the expansion fluid is to use ethylene glycol monobutyl ether to soften and bulk up the drilling slag and the dielectric material on the surface, so as to improve the effectiveness of the subsequent potassium permanganate oxidation. The degumming solution mainly contains potassium permanganate (KMnO 4 ) and sodium hydroxide.

[0021] The method for removing glue on the ...

Embodiment 2

[0049] The deglue method of embodiment 2PCB circuit board

[0050] In the pre-degumming process, the temperature of the expansion liquid is controlled at 74°C, and the expansion time is 5 minutes; KMnO in the degumming liquid 4 The concentration is 55g / L, the temperature is 81°C, and the degumming time is 9min; the baking temperature is 170°C, and the baking time is 2hrs; other methods and parameters are the same as in Example 1, and the degumming of the method in Example 2 is used. The rate is between the standard approval (the degumming rate is controlled at (0.366-0.916) mg / cm 2 ), in full compliance with product design and use requirements. After the degumming process of Example 2, there is no residual glue stain on the glass fiber; the resin surface is uniform and obviously honeycombed, and there is no resin cavity, and there is no glue slag and other residues on the inner copper surface, which has better degumming The effect can better meet the quality requirements of ...

Embodiment 3

[0051] The deglue method of embodiment 3PCB circuit board

[0052] In the pre-degumming process, the temperature of the expansion solution is controlled at 78°C, and the expansion time is 7 minutes; KMnO in the degumming solution 4 The concentration is 65g / L, the temperature is 85°C, and the degumming time is 11min; the baking board temperature is 175°C, and the baking board time is 2hrs; other methods and parameters are the same as in Example 1, and the degumming of the method in Example 3 is used. The rate is between the standard approval (the degumming rate is controlled at (0.366-0.916) mg / cm 2 ), in full compliance with product design and use requirements. After the degumming process of Example 3, there is no residual glue stain on the glass fiber; the resin surface is uniform and obviously honeycombed, and there is no resin cavity, and there is no glue slag and other residues on the inner copper surface, which has better degumming The effect can better meet the quality...

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Abstract

The invention discloses a degumming method of a printed circuit board. Pre-degumming is carried out before degumming, and a primary pre-degumming process comprises the following procedures: board loading, rough grinding, swelling, degumming, neutralizing, drying and board baking. The degumming method of the printed circuit board, disclosed by the invention is characterized in that a pre-degumming process is added on the basis of the original degumming process, by means of the degumming process flow, the board is degummed completely, a resin recession phenomenon is reduced, the phenomenon that no copper is in plated through holes is reduced, and in addition, the board can well meet quality requirements in the aspects of inner-layer separation, hole wall separation, copper disconnection, diffusion coating and resin recession.

Description

technical field [0001] The invention belongs to the field of circuit board manufacturing, and in particular relates to a glue removal method for printed circuit boards. Background technique [0002] With the diversification of the performance of electronic products, various board types and reliability requirements for printed circuit boards, the adhesive removal process is facing challenges. In addition to the high reliability performance, stable process and high cost-effectiveness of the glue process, it also needs to be able to process a series of new performance plates. These new sheets are mainly new resins, new flame retardant sheets, high-content filler sheets, etc. How to maintain its performance to meet the required requirements during the degumming process has become a technical problem for circuit board manufacturers. [0003] The main function of adhesive removal is to provide a more rough surface for the dielectric material, resulting in excellent via reliabili...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38
Inventor 梁炳源黄杏娇
Owner KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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