Induction cooker with novel radiating structure

Abstract

The invention relates to the technical field of induction cookers, in particular to an induction cooker with a novel radiating structure. The induction cooker is characterized in that a radiating plate is arranged on a side surface of a cooker body; heat end surfaces of semiconductor radiating fins are adhered to an inner side surface of the radiating plate on the cooker body; heating elements are fixed on cold end surfaces of the semiconductor radiating fins by fixing spring plates; fixing parts of the fixing spring plates are arranged on the inner side surface, which is opposite to the upper sides of the semiconductor radiating fins, of the radiating plate; pressing parts on the lower sides of the fixing spring plates are pressed against the outer side surfaces of the heating elements; and at least one semiconductor radiating fin is arranged on the radiating plate. Compared with the prior art, the induction cooker is light and small in size, mechanical noises and airflow noises are eliminated, the induction cooker is totally closed, a waterproof and mothproof design is not required, and the structure of the induction cooker is compact. In addition, the service life of a semiconductor refrigerating element is far longer than that of a cooling system using a fan with a motor, and cost is reduced effectively.

Description

technical field [0001] The invention relates to the technical field of electromagnetic ovens, in particular to an electromagnetic oven with a novel heat dissipation structure. Background technique [0002] At present, the heat dissipation of the induction cooker adopts the forced air cooling method, that is, the small electric fan takes the cooling air from the air inlet through the internal air duct of the induction cooker to take away the heat of the high-power heating elements such as the IGBT and the rectifier bridge in the induction cooker and the additionally installed heat sink. , out of the induction cooker through the air outlet, so that the temperature of the power components can be kept below the safe working temperature. [0003] see Figure 7 The disadvantages of the above cooling methods are: 1. The induction cooker shell must have cooling air slots 1-3. The existence of these cooling air slots must consider the waterproof and anti-insect penetration design, ot...

AI Technical Summary

Problems solved by technology

[0003] see Figure 7 The disadvantages of the above cooling methods are: 1. The induction cooker shell must have cooling air slots 1-3. The existence of these cooling air slots must consider the waterproof and anti-insect penetration design, otherwise the stove will often be caused by overflowing pots and insects. Electrical failure; 2. The fan 1-2 is used to dissipate heat on the PCB board 1-4, and the moving parts of the fan 1-2--the motor and the impeller will generate noise and wear, and the service life will also be affected; 3. The original stacked heat sink 1-1 is fixed on the PCB board next to the fan 1-2, and the heating element is fixed on the back of the stacked heat sink 1-1, so that the components inside the induction cooker are concentrated on one PCB board , relatively congested, relatively lack of heat dissipation space

Images