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Preparation method for epoxy pouring sealant with characteristics of low viscosity, high elongation rate, and high strength

A technology of potting glue and epoxy, which is applied in the direction of epoxy resin glue, adhesives, adhesive additives, etc., can solve the problems of high viscosity, poor impact, short pot life and other problems of adhesives, achieve good fluidity, prevent self- Damage and bottoming, strong potting effect

Active Publication Date: 2012-12-12
中昊北方涂料工业研究设计院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to overcome the shortcomings of high brittleness and poor impact of general epoxy potting adhesives, we use polyether amine, double toughened so that the epoxy potting adhesive we prepared has the following advantages: low viscosity, toughening, long pot life The introduction of it solves the problem of high viscosity and short pot life of the adhesive; adjust the curing time of the adhesive through the accelerator, so that the target adhesive has sufficient potting performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Add 23.64g polyethylene glycol 400 into the reactor, heat up to 105°C and vacuumize for 2 hours to dehydrate. Cool down to 60°C and add 15.36g of TDI, react at 70°C for about 2 hours, add 300g of bisphenol A epoxy resin E-51, 90g of butanediol diglycidyl ether, control the reaction temperature at 90°C, and react for 90min. When it is determined that the NCO content is less than 0.5%, the material is cooled and discharged, and then polyetheramine D230, 130g, and the accelerator nonylphenol 20g are mixed and stirred to prepare the epoxy potting glue.

[0012] The performance indicators of the adhesive are as follows: (1) Viscosity: 1000mPa·s at 25°C, (2) Gel time: 4h (3) Shear strength: ≥23MPa (aluminum-aluminum) (4) Tensile strength : ≥36MPa (5) Elongation at break: ≥13% (6) Resistance to enduring stress (16MP) ≥500h.

Embodiment 2

[0014] Add 30 g of polyethylene glycol 600 into the reactor, heat up to 105°C and vacuumize for 3 hours to dehydrate. Cool down to 60°C and add 13g of TDI, react at 70°C for about 2 hours, add 200g of bisphenol A epoxy resin E-51, 100g of butanediol diglycidyl ether, control the reaction temperature at 90°C, react for 90min, measure When the NCO content is less than 0.5%, lower the temperature and add nano-SiO treated with KH550 2 , fully stirred and discharged, and then sequentially added polyetheramine 400, 195g, accelerator DMP-30, 30g and mixed and stirred to prepare epoxy potting glue.

[0015] The performance indicators of the adhesive are as follows: (1) Viscosity: 900mPa·s at 25°C (2) Gel time: 5h (3) Shear strength: ≥27MPa (aluminum-aluminum) (4) Tensile strength: ≥40MPa (5) Elongation at break: ≥14% (6) Fatigue resistance test (16MP) ≥500h.

Embodiment 3

[0017] Add 168g of polyethylene glycol 1000 into the reactor, heat up to 105°C and vacuumize for 4 hours to dehydrate. Cool down to 60°C and add 42g of TDI, react at 70°C for about 2 hours, add 500g of bisphenol A epoxy resin E-51, 200g of ethylene glycol diglycidyl ether, control the reaction temperature at 90°C, react for 90min, measure When the NCO content is less than 0.5%, cool down and discharge, then add polyetheramine 230, 84g, polyetheramine 400, 280g, accelerator399, 60g and mix and stir to prepare epoxy potting glue.

[0018] The performance indicators of the adhesive are as follows: (1) Viscosity: 1300mPa·s at 25°C (2) Gel time: 1h (3) Shear strength: ≥22MPa (aluminum-aluminum) (4) Tensile strength: ≥25MPa (5) Elongation at break: ≥21% (6) Resistance to enduring stress (16MP) ≥400h.

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Abstract

The invention relates to a preparation method for an epoxy pouring sealant with characteristics of low viscosity, high elongation rate, and high strength. According to the present invention, an epoxy resin is modified, nanoparticles and amino-teminated polyoxypropylene are subjected to curing, toughening and viscosity reduction, an active diluent is added, and an accelerating agent is adopted to adjust a working life so as to prepare an epoxy pouring sealant with characteristics of low viscosity, high elongation rate, and high strength.

Description

technical field [0001] The invention relates to a preparation method of a low-viscosity, high-elongation, high-strength epoxy potting glue. Through epoxy resin modification, nano-particle and polyether amine curing, toughening and viscosity reduction, active diluent and accelerator to adjust pot life, an epoxy potting adhesive with low viscosity, high elongation and high strength can be prepared. Background technique [0002] With the technological development of aerospace, aviation and modern industry, some large-scale equipment has been successfully developed. The hoisting, transportation, and carrying of these large-scale equipment put forward higher requirements on the fatigue resistance and impact toughness of the epoxy structural adhesives used, and require the adhesives to have certain potting properties. [0003] Epoxy potting adhesives are widely used in the electronics industry to connect, combine, isolate and protect various electronic components. In order to re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/48C08G59/50C09J175/08C09J163/02C09J11/04
Inventor 徐润斌刘正堂候宴兵
Owner 中昊北方涂料工业研究设计院有限公司
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