High-power LED (Light Emitting Diode) bracket and high-power LED packaging structure

A technology of LED bracket and LED packaging, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of high cost and high cost LEDs being introduced to the market, and achieve low cost, high ultraviolet light shielding, and high heat resistance performance effect

Inactive Publication Date: 2012-12-12
SHENZHEN GLORY SKY OPTOELECTRONICS CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the technology and raw materials of ceramics, the cost of using ceramic brackets is relatively high, and the high cost has become an obstacle to the rapid introduction of LEDs to the market.

Method used

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  • High-power LED (Light Emitting Diode) bracket and high-power LED packaging structure
  • High-power LED (Light Emitting Diode) bracket and high-power LED packaging structure
  • High-power LED (Light Emitting Diode) bracket and high-power LED packaging structure

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Embodiment Construction

[0032] Such as figure 1 , 2 , 3, the present invention discloses a high-power LED bracket, including conductive feet 1a, 1b and a base 2 that wraps the conductive feet 1a, 1b, and a concave cavity 6 is formed on the top of the base 2, so A heat sink 3 is fixed at the bottom of the concave cavity 6, and the base 2 is made of high temperature resistant material. The high temperature resistant material is mainly liquid crystal polymer and contains a plurality of filler particles.

[0033] During the preparation of the molding material, the filler particles are uniformly kneaded into the liquid crystal polymer. Preferably, the greater number of filler particles near the outer surface of the material can be achieved by known mixing and molding methods.

[0034] Because liquid crystal polymers only need hydroxybenzoic acid, acid anhydride, biphenol, and terephthalic acid to melt and polymerize, the heat resistance can reach above 410°C, but its color is slightly yellow. Because a...

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PUM

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Abstract

The invention discloses a high-power LED (Light Emitting Diode) bracket which comprises a conductive pin and a base wrapping the conductive pin. A cavity is formed at the top of the base. A heat sink is fixedly arranged at the bottom of the cavity. The base is made of a high temperature resistant material. The high temperature resistant material is mainly a liquid crystal high-molecular polymer and contains a plurality of filler particles. The high-power LED bracket provided by the invention has the advantages of high heat resistance, high light emitting efficiency, high ultraviolet light shielding performance and low cost. Compared with the PPA (Phenyl-Propanolamine) bracket currently used, the high-power LED bracket provided by the invention has higher heat resistance so that the bracket has good compatibility with a gold and tin eutectic solder which welds the LED onto the base, and therefore, the production efficiency of an LED lamp is improved. Compared with the ceramic bracket currently used, the bracket disclosed by the invention has the advantage that high-efficiency and low-cost production can be realized by an injection molding method. In addition, the invention further discloses a high-power LED packaging structure using the bracket.

Description

technical field [0001] The invention relates to a bracket for LED packaging, in particular to a high-temperature-resistant bracket suitable for packaging high-power light-emitting diodes (LEDs), and a high-power LED packaging structure using the bracket. Background technique [0002] White light emitting diode (Lighting Emitting Diode) has many advantages such as high efficiency, long life, high reliability, environmental protection and energy saving, and flexible application. It is generally recognized as the fourth-generation lighting source and has broad development prospects. Making high-power light sources is the main development trend of LEDs in the future. With the progress of LED technology, the light efficiency of LEDs increases, resulting in more light and heat being dissipated. This requires LEDs to have better heat resistance and The ability to reflect light. The base of the high-power light-emitting diode packaging bracket is a component that reflects most...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48
CPCH01L2224/48091H01L2224/48247
Inventor 卢志荣
Owner SHENZHEN GLORY SKY OPTOELECTRONICS CO LTD
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