Supercharge Your Innovation With Domain-Expert AI Agents!

Interposer and electronic device using the interposer

A technology for electronic devices and interposers, which is applied to semiconductor/solid-state device parts, circuits, electrical components, etc., and can solve the problems of low thermal expansion rate of inorganic insulating materials, damage to connection parts, and reduced electrical reliability of electronic devices.

Active Publication Date: 2015-12-09
KYOCERA CORP
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, since the thermal expansion coefficient of the inorganic insulating material having a small difference from the thermal expansion coefficient of the electronic component is smaller than that of the conductor, when heat is applied to the electronic device, the conductor embedded in the via hole thermally expands more than the substrate and peels off from the inner wall of the via hole. Moreover, it protrudes from the base, and the connection between the interposer and the electronic component may be damaged due to the protrusion, and the electrical reliability of the electronic device is likely to decrease.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Interposer and electronic device using the interposer
  • Interposer and electronic device using the interposer
  • Interposer and electronic device using the interposer

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0023] Hereinafter, an electronic device including the interposer according to the first embodiment of the present invention will be described in detail based on the drawings.

[0024] figure 1 The electronic device 1 shown in (a) is a device used in electronic equipment such as various audio-visual equipment, household electrical appliances, communication equipment, computer equipment or its peripheral equipment, and is electrically connected to external circuits such as female cards. The electronic device 1 includes: an electronic component 2; a wiring substrate 3 on which the electronic component 2 is mounted; an interposer 4 interposed between the electronic component 2 and the wiring substrate 3; The first bump 5a; the second bump 5b electrically connects the interposer 4 and the wiring board 3; and the third bump 5c electrically connects the wiring board 3 and an external circuit.

[0025] The electronic component 2 is mounted on the wiring board 3 via the interposer 4 ...

no. 2 approach

[0121] Next, based on Figure 5 , the electronic device including the interposer according to the second embodiment of the present invention will be described in detail. In addition, the description of the structure similar to the said 1st Embodiment is abbreviate|omitted.

[0122] The second embodiment is different from the first embodiment in that the interposer 4 is not interposed between the wiring board and the electronic component, but is interposed between the electronic components 2 that are separated from each other in the thickness direction. The interposers 4 are alternately stacked in the thickness direction to form the electronic device 1 . Therefore, three-dimensional mounting of the electronic component 2 can be realized, and the electronic device 1 can be miniaturized and signal transmission characteristics can be improved.

[0123] The electronic device 1 is electrically connected to an external circuit such as a female via the third bump 5c connected to the...

no. 3 approach

[0148] Next, based on Figure 7 , the electronic device including the interposer according to the third embodiment of the present invention will be described in detail. It should be noted that descriptions of the same configurations as those of the first and second embodiments described above are omitted.

[0149] The third embodiment is the same as the second embodiment, electronic components 2 and interposers 4 are alternately stacked in the thickness direction to form an electronic device 1, but the electrical connection method of the alternately stacked electronic components 2 and interposers 4 is the same as that of the second embodiment. different.

[0150] Hereinafter, the electrical connection form of the alternately stacked electronic components 2 and the interposer 4 will be specifically described.

[0151] Like the second embodiment, the first conductive layer 15a connected to the upper end of the through conductor 16 of the first interposer 4a is electrically con...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

There is provided an interposer which meets the need of improving electrical reliability of an electronic device. An interposer includes a substrate including a penetrating-hole in a thickness direction thereof, and a penetrating conductor disposed in the penetrating-hole. The substrate includes a first insulating layer and a second inorganic insulating layer which are separated from each other in the thickness direction, and a first resin layer interposed between the first inorganic insulating layer and the second inorganic insulating layer and being in contact with the first inorganic insulating layer and the second inorganic insulating layer. A coefficient of thermal expansion of the first resin layer in thickness and planar directions thereof is larger than those of the first inorganic insulating layer and the second inorganic insulating layer.

Description

technical field [0001] The present invention relates to an interposer used in electronic equipment (such as various audio-visual equipment, home appliances, communication equipment, computer equipment and peripheral equipment thereof) and the like, and an electronic device using the interposer. Background technique [0002] Conventionally, electronic devices including a wiring board and electronic components mounted on the wiring board have been used as electronic equipment. [0003] Japanese Patent Application Laid-Open No. 11-214449 describes an electronic device including a wiring board and a bare chip flip-chip mounted on the wiring board. [0004] In this way, when the bare chip is flip-chip mounted on the wiring board, when heat is applied to the electronic device during bare chip mounting or operation, the difference in thermal expansion coefficient between the wiring board and the bare chip will cause the Thermal stress is generated at the connection portion between...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/15H01L23/32
CPCH01L23/49827H01L23/145H01L23/481H01L23/49816H01L23/49822H01L23/49894H01L24/13H01L24/16H01L25/0657H01L25/105H01L2224/13109H01L2224/13111H01L2224/13113H01L2224/13116H01L2224/13118H01L2224/13124H01L2224/13139H01L2224/13144H01L2224/13147H01L2224/16225H01L2224/16227H01L2224/16235H01L2225/06517H01L2225/06541H01L2225/06548H01L2225/06572H01L2225/1023H01L2225/1058H01L2924/01004H01L2924/01012H01L2924/0102H01L2924/01078H01L2924/01079H01L2924/10252H01L2924/10253H01L2924/10272H01L2924/10329H01L2924/1033H01L2924/10342H01L2924/12042H01L2924/14H01L2924/1431H01L2924/1432H01L2924/1434H01L2924/15172H01L2924/15192H01L2924/15311H01L2924/15331H01L2924/1579H01L2924/15798H01L2924/00
Inventor 林桂
Owner KYOCERA CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com