Feeding device for chip mounter

Abstract

The invention discloses a feeding device for a chip mounter, which comprises a feeding chassis, feeding motors, feeding gears, a material pressure cover, a material pressure spring plate and a tongue station. The feeding chassis is provided with both front and rear cavities; worms and the feeding gears are arranged in the front cavity; the worms are connected with the feeding gears; the feeding motors are arranged in the rear cavity; a feeding machine cover is fixed above the feeding chassis; the material pressure cover is arranged at the upper part of the feeding machine cover; the material pressure spring plate is arranged at the front end of the upper part of the feeding machine cover; the feeding machine cover is at least provided with two separation fences for separating different carrier tapes to form a plurality of feeding channels; and at least three feeding motors are provided and are respectively connected with the corresponding worms. According to the invention, a plurality of feeding channels are formed, so that one feeding device can be provided with a plurality of feeding channels for carrying out conveying of a plurality of components and a plurality of components can be simultaneously assembled, produced and processed, so that the feeding efficiency of the feeding device for the chip mounter is improved and the manufacturing cost of the chip mounter is also reduced.

Description

technical field [0001] The present invention relates to an accessory for a chip mounter, more precisely, a feeding device for a chip mounter capable of simultaneously continuously and automatically feeding electronic components such as semiconductor chips held at regular intervals to Pick and place machines to place electronic components onto printed circuit boards. Background technique [0002] With the pursuit of miniaturization and rapid production of electronic products, the original perforated plug-in components have been difficult to meet the requirements. SMT (Surface Mounted Technology, Surface Mount Technology) has become the most popular technology and process in the electronic assembly industry. SMT not only The assembly density is high, the electronic products are small in size and light in weight, and it is easy to realize mass production and automatic production of products. The placement machine is the main equipment in the surface mount technology production...

AI Technical Summary

Problems solved by technology

[0005] At present, the feeding device of the placement machine used is that each feeding device processes a group of carrier tapes. Therefore, the placement machine needs to install multiple sets of feeding devices. Under normal circumstances, each placement machine 30-40 feeding devices need to be installed, which increases the complexity and cost of the placement machine and cannot effectively improve production efficiency

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