Assembly device for welding circuit board and heat sinking base plate and welding method thereof

Abstract

The invention discloses an assembly device for welding a circuit board and a heat sinking base plate and a welding method of the assembly device, relating to the emitting and manufacturing technical field of a radio and a television. The assembly device comprises clamping board layers consisting of a bottom board, a middle board and a top board which are horizontally arranged in sequence, and a clamping rod which is arranged on the centers of the clamping plate layers and penetrates through the three layers of the clamping plates, wherein a clamp handle capable of clamping or loosening the three layers of the clamping plates is arranged on the top end of the clamping rod; and bolts for fixing the three layers of the clamping plates are respectively arranged on four corners of the clamping plate layers. A welding piece consisting of a power amplifier module circuit board and the heat sinking base plate can be arranged on the bottom board; a plurality of pressing columns with pressure spring devices are fixedly connected below the middle board vertically; and a position of each pressing column is in one-to-one correspondence with the power amplifier module circuit board and a pressing hole on the heat sinking base plate respectively. Compared with the prior art, the assembly device can effectively ensure the power amplifier module circuit board to reliably connect with the heat sinking base plate for a long time, so as to achieve good electrical conductivity and thermal conductivity, and improve working stability and reliability of an amplifier.

Description

technical field [0001] The invention relates to the technical field of radio and television transmission manufacturing, in particular to a tooling device and a welding method for curing and welding a circuit board of a power amplifier module and a heat sink substrate. Background technique [0002] In a broadcast television transmitter, the power amplifier is a core component used for signal amplification. Its stability and reliability directly affect the performance, signal transmission and signal coverage of the transmitter. [0003] In the prior art, screw fastening is widely used to connect the circuit board of the amplifier module and the heat sink substrate. This method has many disadvantages: in the initial stage of screw fastening, the good contact between the circuit board and the heat sink substrate can be ensured, but after the transmitter has been working for a period of time, the surface deformation of the circuit board and the heat sink substrate due to temper...

AI Technical Summary

Problems solved by technology

This method has many disadvantages: in the initial stage of screw fastening, the good contact between the circuit board and the heat sink substrate can be ensured, but after the transmitter has been working for a period of time, the surface deformation of the circuit board and the heat sink substrate due to temperature changes will cause the gap between contact surfaces

During the long-term operation of the transmitter, impurities such as dust and dirt deposited in the gap will directly affect the conduction and heat conduction of the heat sink substrate, resulting in poor stability of the amplifier. tube damage

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