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Double-sided reusable templates for semiconductor substrates for fabrication of photovoltaic cells and microelectronic devices

A double-sided, template technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, photovoltaic power generation, etc.

Inactive Publication Date: 2016-01-20
TRUTAG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The device can process multiple wafers at a time in batch mode, but only one side of each template is usable

Method used

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  • Double-sided reusable templates for semiconductor substrates for fabrication of photovoltaic cells and microelectronic devices
  • Double-sided reusable templates for semiconductor substrates for fabrication of photovoltaic cells and microelectronic devices
  • Double-sided reusable templates for semiconductor substrates for fabrication of photovoltaic cells and microelectronic devices

Examples

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Embodiment Construction

[0027] Although the present invention is described with reference to specific embodiments, those skilled in the art can apply the principles discussed herein to other places and / or embodiments without undue experimentation.

[0028] 1A and 1B show schematic cross-sectional views of the double-sided flat template 10 before and after the TFSS 12 is separated from both sides. As illustrated in FIG. 1A, through an epitaxial silicon growth process, in some embodiments, simultaneously, an epitaxially grown silicon layer is formed on both sides of the planar template and on top of the porous silicon layer 14 on the front and back surfaces of the template. The template may be made of a single crystal silicon wafer with a polished surface (although wafers and / or polycrystalline silicon wafers with an unpolished surface may also be used as templates). The wafer diameter may be in the range of about 150 to 450 mm, and the wafer thickness may be in the range of about 0.5 to 1 mm. Thicker wa...

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Abstract

The invention provides a manufacturing method and equipment for manufacturing TFSS on both sides of a reusable semiconductor template, thereby effectively increasing the yield of the substrate and reducing its manufacturing cost. For a given number of template reuse cycles, this approach cuts the initial template cost per fabricated substrate (TFSS) in half.

Description

[0001] Cross references to related applications [0002] This application claims the priority of U.S. Provisional Patent Application Serial No. 61 / 304340 filed on February 12, 2010, which is incorporated herein by reference in its entirety. Other related applications with co-inventors and / or ownership are also mentioned throughout the specification, and the full text is also incorporated herein by reference. Technical field [0003] The present invention generally relates to the field of photovoltaics and microelectronics, and more specifically to the manufacturing process and manufacturing equipment of thin film (or thin foil) crystal (single crystal, polycrystalline) semiconductor substrates. In some embodiments, thin film or thin foil The thickness ranges from approximately 1 micrometer to 100 micrometers. The present invention provides such low-cost and high-throughput production. Background technique [0004] At present, crystalline silicon has the largest market share in the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/18
CPCH01L21/02381H01L21/0245H01L21/02513H01L21/02532H01L31/1804Y02E10/547Y02P70/50H01L21/20
Inventor M·M·穆斯利赫K·J·克拉默D·X·王P·卡普尔S·纳格G·卡米安J·亚西伊T·米原隆夫
Owner TRUTAG TECH