Detection method for resin bonding strength

Abstract

The invention discloses a detection method for resin bonding strength. The method includes parallelly marking two marking lines on test paper, bonding double-side adhesive tapes at the outer sides of the marking lines of the test paper, respectively; bonding two test wire materials onto the double-side adhesive tapes perpendicular to the marking lines, respectively, and lapping the test wire materials in the parallel region of the marking lines; coating to-be-detected resin at the lapping parts of the test wire materials; performing fixing treatment to the sections of the test wire materials bonded with the double-side adhesive tapes; performing curing treatment to the to-be-detected resin; holding the test wire materials covered by the to-be-detected resin subjected to the curing treatment onto the fixture of a tension machine for tension testing to obtain fracture tension F; and substituting the fracture tension F into the bonding strength formula to obtain the bonding strength Sigma. Owing to the scheme, the method can improve the detection accuracy of the bonding strength of brittle resins, thus, is suitable for detecting the bonding strength of resins with brittleness characteristic.

Description

technical field [0001] The invention relates to the technical field of silicon wafer cutting, in particular to a resin bonding strength detection method. Background technique [0002] With the rapid development of the solar energy industry, silicon wafer cutting technology has developed from inner circle cutting to wire cutting. The wire cutting has developed from the wire cutting of free abrasives to the wire cutting of fixed abrasives. Among them, wire cutting with fixed abrasives generally attaches diamonds to steel wires by means of electroplating or resin bonding. Usually, diamond wire saws bonded by resin are called resin diamond wire saws. Since the bonding strength of the resin is related to the bonding force between the resin and the steel wire, the holding force between the resin and the diamond, and the filler, it is very important to detect the bonding strength of the resin. [0003] An existing detection method for resin bonding strength is: metal-mounted str...

AI Technical Summary

Problems solved by technology

In the process of testing the bonding strength using this method, the resin to be tested is coated on the metal sheets that are carried together. When the bonding strength is tested using a tensile machine, the metal sheets affect each other and produce tension perpendicular to the stretching direction. The side force causes the resin layer to rupture, thus affecting the accuracy of resin bond strength detection

Moreover, due to the large contact area with the metal sheet when the resin is coated, it may cause bubbles in the resin above the metal sheet during the curing process, which also affects the accuracy of the bonding strength

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