Detection method for resin bonding strength

A technology of strength detection and resin bonding, applied in measuring devices, instruments, mechanical devices, etc., can solve problems affecting the accuracy of bonding strength, cracking of resin layers, affecting the accuracy of resin bonding strength, etc., to improve the detection The effect of accuracy

Active Publication Date: 2013-01-02
浙江东大树脂科技股份有限公司
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Problems solved by technology

In the process of testing the bonding strength using this method, the resin to be tested is coated on the metal sheets that are carried together. When the bonding strength is tested using a tensile machine, the metal sheets affect each other and produce tension perpendicular to the stretching direction. The side force

Method used

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  • Detection method for resin bonding strength
  • Detection method for resin bonding strength
  • Detection method for resin bonding strength

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Embodiment Construction

[0018] In order to realize the accurate detection of the bonding strength of the resin with brittle characteristics, an embodiment of the present invention provides a method for detecting the bonding strength of the resin, including:

[0019] Mark two parallel marking lines on the test paper, and paste the double-sided tape on the outside of the marking lines of the test paper respectively;

[0020] Paste two test wires perpendicular to the marking line on the double-sided adhesive tape respectively, and the test wires overlap in the parallel area of ​​the marking line;

[0021] Coating the resin to be tested on the overlapping joints of the test wires;

[0022] Fixing the section where the test wire is pasted with double-sided tape;

[0023] Curing the resin to be tested;

[0024] Clamp the test wire covered by the cured resin to be tested to the fixture of the tensile machine to perform a tensile test to obtain the breaking force F;

[0025] Substitute the breaking force ...

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Abstract

The invention discloses a detection method for resin bonding strength. The method includes parallelly marking two marking lines on test paper, bonding double-side adhesive tapes at the outer sides of the marking lines of the test paper, respectively; bonding two test wire materials onto the double-side adhesive tapes perpendicular to the marking lines, respectively, and lapping the test wire materials in the parallel region of the marking lines; coating to-be-detected resin at the lapping parts of the test wire materials; performing fixing treatment to the sections of the test wire materials bonded with the double-side adhesive tapes; performing curing treatment to the to-be-detected resin; holding the test wire materials covered by the to-be-detected resin subjected to the curing treatment onto the fixture of a tension machine for tension testing to obtain fracture tension F; and substituting the fracture tension F into the bonding strength formula to obtain the bonding strength Sigma. Owing to the scheme, the method can improve the detection accuracy of the bonding strength of brittle resins, thus, is suitable for detecting the bonding strength of resins with brittleness characteristic.

Description

technical field [0001] The invention relates to the technical field of silicon wafer cutting, in particular to a resin bonding strength detection method. Background technique [0002] With the rapid development of the solar energy industry, silicon wafer cutting technology has developed from inner circle cutting to wire cutting. The wire cutting has developed from the wire cutting of free abrasives to the wire cutting of fixed abrasives. Among them, wire cutting with fixed abrasives generally attaches diamonds to steel wires by means of electroplating or resin bonding. Usually, diamond wire saws bonded by resin are called resin diamond wire saws. Since the bonding strength of the resin is related to the bonding force between the resin and the steel wire, the holding force between the resin and the diamond, and the filler, it is very important to detect the bonding strength of the resin. [0003] An existing detection method for resin bonding strength is: metal-mounted str...

Claims

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Application Information

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IPC IPC(8): G01N19/04
Inventor 刘伟万容兵赵涛
Owner 浙江东大树脂科技股份有限公司
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