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Method of attaching a metal surface to a carrier

A metal surface and carrier technology, which is applied in the manufacture of electrical solid state devices, semiconductor devices, semiconductor/solid state devices, etc., can solve the problems of chip connection and other problems

Active Publication Date: 2016-04-27
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, making stable chip connections remains problematic, especially when using adhesives such as paste or glue

Method used

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  • Method of attaching a metal surface to a carrier
  • Method of attaching a metal surface to a carrier
  • Method of attaching a metal surface to a carrier

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0081] According to an embodiment, the carrier comprises a printed circuit board.

[0082] According to an embodiment, the carrier comprises a further chip.

[0083] According to an embodiment, the carrier comprises a semiconductor wafer.

[0084] According to an embodiment, the carrier includes a lead frame.

[0085] A chip packaging module is disclosed. The chip packaging module includes: a chip and a chip carrier; a first polymer layer formed on the surface of the chip; a second polymer layer formed on the surface of the chip carrier; at least one of an interpenetrating polymer structure and an interdiffused polymer structure formed between the layer and the second polymer layer;

[0086] According to an embodiment, the first polymer layer on the surface of the chip has a thickness ranging from about 100 nm to about 5 μm.

[0087] According to an embodiment, the second polymer layer on the surface of the chip carrier has a thickness ranging from about 100 nm to about 5 μ...

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Abstract

The invention provides a method of attaching a metal surface to a carrier, a method of attaching a chip to a chip carrier, a chip packaging module and a packaging module, wherein the method of attaching a metal surface to a carrier includes: forming a first polymer layer on the metal surface ; Forming a second polymer layer on the surface of the carrier; bringing the first polymer layer into physical contact with the second polymer layer, thereby forming an interpenetrating polymer structure between the first polymer layer and the second polymer layer and at least one of interdiffused polymer structures.

Description

technical field [0001] Various embodiments relate generally to methods of attaching metal surfaces to carriers, methods of attaching chips to chip carriers, chip packaging modules, and packaging modules. Background technique [0002] The present invention generally relates to creating a reliable and stable connection between a chip and a chip carrier and maintaining a stable connection to a chip encapsulation layer. Many different methods are known for connecting a chip to a chip encapsulation, however, few methods are known for reliably connecting a chip to a chip carrier. Hitherto, attempts to improve the adhesion of the chip to the chip carrier have been made by modifying the surface of the chip carrier. However, making stable chip connections remains problematic, especially when using adhesives such as paste or glue. Contents of the invention [0003] An embodiment is a method of attaching a metal surface to a support, the method comprising: forming a first polymer l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/58H01L21/56H01L23/29
CPCH01L24/83H01L24/32H01L2224/2919H01L2224/32225H01L2224/83193H01L2924/181Y10T156/10Y10T428/31536H01L24/29H01L2924/00
Inventor 哈利勒·哈希尼弗朗茨-彼得·卡尔茨约阿希姆·马勒曼弗雷德·门格尔
Owner INFINEON TECH AG
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