Laminating method for multi-layer LED mixed-material circuit boards

Abstract

The invention relates to a laminating method for multi-layer LED mixed-material circuit boards. The laminating method includes the following steps of firstly, subjecting a conductive material layer of a PNL (panel) board on each layer to oxygroup processing; secondly, selecting a ceramic material with two sides having protective films as an insulation material, and pre-baking the insulation material; thirdly, cutting the insulation material layer; fourthly, pre-staking the conductive material layer and the insulation material layer; fifthly, falsely laminating the pre-stacked board obtained in the fourth step, namely, enabling the insulation material layers and the conductive material layers of the adjacent PNL boards to be attached by the aid of a hot cylindrical rolled and pre-stacked board; and sixthly, according to the conventional manner, subjecting the pre-stacked board subjected to the false lamination in the fifth step to laminating, disassembling, drilling target holes with X-ray, turning and edging / filleting. By the laminating method, breakage of the insulation material and deviation among different material layers or various laminated surfaces can be effectively avoided and eliminated, local glue flowing can be avoided, the thickness uniformity of a medium layer can be guaranteed, and fusing degree of the insulation material layers and the conductive material layers is increased.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a lamination method of a multilayer LED mixed material circuit board. Background technique [0002] The mixed material circuit board is formed by laminating two or more different conductive material layers and insulating material layers at intervals, such as: aluminum plate (pure aluminum layer) and copper foil layer are separated and laminated by insulating material layer to form aluminum copper Foil mixed material circuit boards. The mixed material circuit board can not only reflect the good electrical conductivity of the copper layer, but also reflect the good heat dissipation performance of the aluminum layer, and has the characteristics of long service life and adaptability to special environments. The conductive material layer of the mixed material circuit board can be laminated with different metal properties materials according to actual needs, which can better hi...

AI Technical Summary

Problems solved by technology

In the existing multi-layer LED mixed material circuit board process, lamination and pressing are mainly for lamination of the same kind of conductive material layer. Using the existing lamination and lamination method to press dissimilar materials can easily cause positioning deviation. Therefore, the existing Lamination and lamination are not suitable for mixed lamination of layers of different conductive materials

Moreover, the insulating material layer used in the existing process is mostly resin or ceramic material without a protective film, and the insulating performance of the resin is relatively poor. As an insulating material layer of a multilayer LED mixed material circuit board, there is a hidden danger of unstable insulating performance.

The ceramic material without a protective film is hard and brittle. In the existing multi-layer LED hybrid material circuit board process, direct cutting of it will cause the ceramic material to break, resulting in scrapping and increasing costs.

At present, the insulating material layer used is more colloidal, which is easy to melt and flow out due to high temperature during pressing, so that the thickness of the insulating material layer is not enough

The melted insulating material flows into the gap and is easy to bond with the insulating material layer of the adjacent plate, resulting in regional glue flow, resulting in uneven thickness of the insulating material layer

This will cause poor fusion between the insulating material layer and the conductive material layer, reduce the insulation performance, or cause displacement between the layers in the later steps, which will adversely affect the quality of the circuit board

In addition, the poor bonding force between the insulating material layer and the conductive material layer is also easily affected by external forces. It is easy to cause displacement between different material layers or between the board surfaces of each layer during lamination, and the dimensions cannot be aligned, resulting in subsequent molding. Deformation occurs, reducing the quality of the circuit board