Atomic beam filling processing device

An atomic beam and carrier plate technology, applied in the field of workpiece surface processing, can solve the problems of inconvenient processing, bulky, complex ion beam generating device, etc., and achieve the effect of full filling processing

Inactive Publication Date: 2013-01-16
XIAMEN UNIV
View PDF4 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the ion beam generating device is usually relatively complex and bulky, which causes great inconvenience during processing, and the m

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Atomic beam filling processing device
  • Atomic beam filling processing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0010] see figure 1 and 2 , the embodiment of the present invention is provided with a base 1, a linear motor 2, an X-axis bearing plate 3, a Y-axis bearing plate 4, a pillar 5, a beam 6, a Z-axis bearing plate 7, a rotating disc 8, a fixed seat 9, and a servo motor 10 , atomic beam generating device 11, atomic beam energy control device 12 and collimation device 13; the linear motor 2 is fixed on the base 1, and is fixedly connected with the X-axis carrier plate 3 through the connecting block, and the X-axis carrier plate 3 is connected with the The base 1 is connected by sliders and guide rails; between the Y-axis bearing plate 4 and the X-axis bearing plate 3, between the Z-axis bearing plate 7 and the beam 6 is connected by a linear motor 2 and a connecting block and adopts sliders and guide rails The pillars 5 are fixed on both ends of the base 1, the beam 6 is connected to the pillars 5, the rotating disk 8 is equipped with an arc-shaped rack 14 and is fixed on the Z-ax...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an atomic beam filling processing device, and relates to a workpiece surface processing method. The device comprises a base, a linear motor, an X-axis bearing plate, a Y-axis bearing plate, supports, a beam, a Z-axis bearing plate, a rotating disk, a fixing seat, a servomotor, an atomic beam generator, an atomic beam energy control device and a collimating device, wherein the linear motor is fixed on the base and is fixedly connected with the X-axis bearing plate which is connected with the base; the Y-axis bearing plate is connected with the X-axis bearing plate, and the Z-axis bearing plate is connected with the beam; the supports are fixed at two ends of the base; the beam is connected with the supports; the rotating disk is fixed on the Z-axis bearing plate; the servomotor is fixed on the Z-axis bearing plate; the tail of a rotating shaft of the servomotor is provided with a gear; the atomic beam generator is arranged on the upper part of the atomic beam energy control device; the collimating device is arranged at the bottom of the atomic beam energy control device and is aligned with a workpiece surface defect; the atomic beam energy control device is fixed on the rotating disk through the fixing seat; and an atomic beam filling device is arranged on the Z-axis bearing plate.

Description

technical field [0001] The invention relates to a workpiece surface processing method, in particular to an atomic beam filling processing device. Background technique [0002] Ion beam processing is a typical microfabrication process and ultra-precision processing method for the surface of the sample in units of atoms and molecules. It has broad application prospects in the microelectronics industry and has become an indispensable process in the manufacture of micromachines. (Zhang Dongyan, Chen Techao. Development of a new type of ion beam etching device [J]. Special Equipment for Electronic Industry, 2010, (01): 34-36.), this is a project involving microelectronics, optoelectronics, precision machinery , computer, micro-analysis and other comprehensive fields of high-tech. This technology is mainly used in the field of microfabrication such as etching, implantation, exposure, deposition, mask correction, and integrated circuit repair; the field of high spatial resolution ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B23K28/00B23P9/00
Inventor 杨炜王春锦吴沿鹏郭隐彪
Owner XIAMEN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap