Thin film pattern forming apparatus, thin film pattern forming method and adjustment method for thin film pattern forming apparatus
A thin film pattern and pattern technology, which is applied in the direction of printing devices, spraying devices, and devices for coating liquid on the surface, etc., can solve problems such as having to stop, nozzle hole clogging, etc., achieve easy relative position, and suppress the decline in the operating rate of the device Effect
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Embodiment 1
[0063] figure 1 A schematic view of the thin film forming apparatus of Example 1 is shown in . An object stage 25 is held on the bottom plate 20 via a moving mechanism 21 . The movement mechanism 21 includes an X movement mechanism 22 , a Y movement mechanism 23 , and a θ rotation mechanism 24 . Define an XYZ rectangular coordinate system in which the horizontal plane is the XY plane and the vertical direction is the Z-axis. The X moving mechanism 22 moves the Y moving mechanism 23 in the X-axis direction. The Y movement mechanism 23 moves the θ rotation mechanism 24 in the Y direction. The θ rotation mechanism 24 changes the posture of the stage 25 in the rotation direction with an axis parallel to the Z axis as a rotation center. The stage 25 holds a substrate (for example, a printed wiring board) 50 to be formed into a thin film. For the stage 25, for example, a vacuum chuck is used.
[0064] A crossbeam 31 is supported above the bottom plate 20 through a pillar 30 . ...
Embodiment 2
[0114] Figure 10 A schematic diagram of a thin film forming apparatus according to Example 2 is shown in . An imaging device 80 is mounted on the stage 25 . By moving the stage 25 and arranging the imaging device 80 directly below the nozzle unit 40 , it is possible to image a part of the plurality of nozzle holes of the nozzle unit 40 with the imaging device 80 . other structures with figure 1 The thin film forming apparatus of Example 1 shown has the same structure. In addition, in Embodiment 1, a plurality of nozzle units 40 are attached to the nozzle unit support mechanism 65 . In the description of Embodiment 2, an example in which one nozzle unit 40 is attached to the nozzle unit support mechanism 65 will be described. In addition, also in Example 2, similarly to Example 1, a plurality of nozzle units 40 can be attached to the nozzle unit support mechanism 65 . Hereinafter, the description of the same structure as that of the first embodiment will be omitted.
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Embodiment 3
[0140] Figure 18 A schematic diagram of a thin film forming apparatus 171 including a droplet discharge apparatus according to Example 3 is shown. The thin film forming device 171 includes an alignment station 102, an inspection film formation station 103, a substrate inversion station 104, an alignment station 105, an inspection film formation station 106, an ultraviolet irradiation device 108, and lifters 111-114 arranged inside the housing 118. . In addition, the housing 118 of the thin film forming apparatus 171 is provided with a substrate import port 101 and a substrate export port 107 . The thin film forming device 171 is used to form thin film patterns such as solder resists on the front and back surfaces of the substrates 121 to 127 which are rectangular printed wiring boards, for example. The thin film forming device 171 includes a conveyor 115 , a conveyor 116 , and a control device 120 . The movement of the substrates 121 to 127 from the outside to the inside o...
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