High heat conduction epoxy resin composition applicable to fully wrapped devices and preparation method

A technology of epoxy resin and composition, which is applied in the preparation of epoxy resin composition and the field of high thermal conductivity epoxy resin composition, which can solve the problems of poor mixing effect and more insoluble matter, and achieve strong conveying force and less pores , Wide applicability

Active Publication Date: 2013-02-06
JIANGSU HHCK NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this traditional method is often accompanied by many insolubles and poor mixing effect.

Method used

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  • High heat conduction epoxy resin composition applicable to fully wrapped devices and preparation method
  • High heat conduction epoxy resin composition applicable to fully wrapped devices and preparation method
  • High heat conduction epoxy resin composition applicable to fully wrapped devices and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Embodiment 1, an epoxy resin composition suitable for fully encapsulating devices, the composition is composed of epoxy resin, phenolic resin, inorganic filler, thermally conductive filler and additive;

[0039] The epoxy resin is the epoxy resin shown in the general formula [1] and the general formula [2]; the ratio of the two is not less than 30% of the epoxy resin amount, and the content of the epoxy resin accounts for the total amount of the composition. 4% for quality;

[0040] The phenolic resin is the phenolic resin shown in the general formula [3] and the general formula [4], the ratio of the two is not less than 10% of the amount of the phenolic resin, and the content of the phenolic resin accounts for 4% of the total mass of the composition ;

[0041] In various formulas: n=0-5; m=1-5;

[0042] The thermally conductive filler is one or more of crystalline silica powder, alumina powder or silicon nitride powder; the content of the thermally conductive filler ...

Embodiment 2

[0045] Embodiment 2, an epoxy resin composition suitable for fully encapsulating devices, the composition is composed of epoxy resin, phenolic resin, inorganic filler, thermally conductive filler and additive;

[0046] The epoxy resin is the epoxy resin shown in the general formula [1] or the general formula [2]; the content of the epoxy resin accounts for 3% of the total mass of the composition;

[0047] The phenolic resin is the phenolic resin represented by the general formula [3] or the general formula [4], and the content of the phenolic resin accounts for 2% of the total mass of the composition;

[0048] In various formulas: n=0-5; m=1-5;

[0049] The thermally conductive filler is one or more of crystalline silica powder, alumina powder or silicon nitride powder; the content of the thermally conductive filler is 20% of the total mass of the composition;

[0050] The content of described inorganic filler is 70% of total composition quality;

[0051] The additives are c...

Embodiment 3

[0052] Embodiment 3, an epoxy resin composition suitable for fully encapsulating devices, the composition is composed of epoxy resin, phenolic resin, inorganic filler, thermally conductive filler and additive;

[0053] The epoxy resin is the epoxy resin shown in the general formula [1] and the general formula [2]; the ratio of the two is not less than 10% of the epoxy resin amount, and the content of the epoxy resin accounts for the total amount of the composition. 7% for quality;

[0054] The phenolic resin is the phenolic resin shown in the general formula [3] and the general formula [4], the ratio of the two is not less than 30% of the amount of the phenolic resin, and the content of the phenolic resin accounts for 6% of the total mass of the composition ;

[0055] In various formulas: n=0-5; m=1-5;

[0056] The thermally conductive filler is one or more of crystalline silica powder, alumina powder or silicon nitride powder; the content of the thermally conductive filler ...

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Abstract

An epoxy resin composition applicable to fully wrapped devices is composed of an epoxy resin, a phenolic resin, an inorganic filling agent, a heat conduction filler and an additive. The epoxy resin is represented as a formula (1) and/or a formula (2), and the mass content of the epoxy resin is 2-7% of the total mass of the composition; the phenolic resin is represented as a formula (3) and/or a formula (4), and the mass content of the phenolic resin is 2-7% of the total mass of the composition; and the heat conduction filler is a crystallized silicon dioxide powder, an aluminum oxide powder or a silicon nitride powder. The invention further discloses a preparation method of the epoxy resin composition. The epoxy resin composition has the advantages of being wide in applicability, high in filling, few in pores and high in reliability. According to the preparation method, open mixing rollers are added between an extruder and a fluted roller in traditional epoxy resin composition production processes for open milling and mixing, and a thread groove is added onto a grooved roller with low temperatures, so that the preparation method has the advantages of being high in conveying capacity and large in shear cutting force.

Description

technical field [0001] The invention relates to an epoxy resin composition, especially a high thermal conductivity epoxy resin composition suitable for fully encapsulating devices; the invention also relates to a preparation method of the epoxy resin composition. Background technique [0002] Fully encapsulated devices are mainly used for electronic products that require high current and high power. The thickness of the back is generally 0.9-1.0mm, which greatly affects the heat dissipation of fully encapsulated devices. When the heat dissipation is poor, the temperature of the electronic product will reach above 70°C during operation. Such a high temperature will have a great impact on the working stability of the triode, which will have a significant impact on the performance of the entire electronic product. Therefore, in order to improve the heat dissipation and ensure the reliability of electronic products, the thickness of the back of the fully encapsulated device is c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/04C08L61/08C08K13/02C08K3/36C08K3/22C08K3/28B29B7/56B29B7/62
Inventor 成兴明薛建明朱宁平谭伟侍二增崔亮李兰侠刘红杰
Owner JIANGSU HHCK NEW MATERIAL CO LTD
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