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Glue-pouring machine

A glue filling machine and glue filling technology, which is applied in the field of glue filling machines, can solve problems such as uneven glue filling, high viscosity of potting glue, and affecting heat dissipation effects, etc.

Active Publication Date: 2013-02-13
SHENZHEN ZHENHUA MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Commonly used glue filling equipment integrates a computer program control system integrating automatic glue mixing, glue mixing and quantitative glue filling. The horizontal movement of the (potting head) can basically achieve a good glue sealing effect, but for products that can only be potted through small holes or openings after sealing, the M-shaped tube cannot move freely, and the viscosity of the potting glue Larger, poor fluidity, resulting in slow diffusion of the colloid to the surroundings of the product, and the accumulation of colloid directly below the small hole, which seriously affects the product potting, especially the two-component potting glue, which can be used at room temperature within 1 hour after compounding. Often the colloid is solidified, the interior of the product is not filled with glue, and the colloids are filled with air gaps, and the colloid filling is uneven, resulting in "lack of meat" or vacuum "caves" inside the filling, which seriously affects the heat dissipation effect

Method used

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Embodiment Construction

[0013] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0014] See Figure 1 to 3 , Showing that the glue filling machine 10 of the embodiment of the present invention includes a glue filling holding rod 11 and a glue filling product fixing mechanism 12, and the glue filling product 20 has a glue filling hole 21 (see image 3 ), the glue filling machine 10 further includes a rotating platform 13, and the glue filling product fixing mechanism 12 is installed on the rotating platform 13 and used to fix the glue filling product 20 so that the glue hole 21 is aligned with the rotation axis of the rotating platform 13, and the rotating platform 13 is u...

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Abstract

The invention relates to a glue-pouring machine which comprises a glue-pouring fixing rod and a glue-pouring product fixing mechanism. A glue-pouring product is provided with a glue-pouring hole; the glue-pouring machine also comprises a rotating platform; the fixing mechanism is installed on the rotating platform and is used for fixing the glue-pouring product, so that the glue-pouring hole is aligned with a rotating shaft of the rotating platform; and the rotating platform is used for driving the glue-pouring product to carry out fixed-point rotation around the glue-pouring hole. Thus, when glue is poured, colloids poured through the glue-pouring hole diffuse towards the periphery under the action of rotating centrifugal force and are gradually accumulated and encapsulated from the edge to the center (such as an axis of rotation); and by utilizing the centrifugal force, air gaps among the colloids can be effectively avoided, so that the glue is uniformly poured. The glue-pouring machine can be widely applied to glue-pouring various products glue-poured through the hole.

Description

Technical field [0001] The invention belongs to the technical field of packaging, and specifically relates to a glue filling machine. Background technique [0002] In the current manufacturing of many products, it is usually necessary to encapsulate by glue. In the manufacture of some electronic products, it is necessary to encapsulate some components such as electronic or circuit components inside. For example, in the case of a power supply product packaged in a box body, it is necessary to pour glue into the box body through a small hole with a diameter of only 8 mm due to heat dissipation requirements. Commonly used glue filling equipment integrates a computer program control system that integrates automatic glue mixing, glue mixing and quantitative glue filling. For most of the open system (after glue filling and then sealing or direct gel sealing) products, through the M-shaped tube The horizontal movement of the (pouring head) can basically achieve a good potting sealing ...

Claims

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Application Information

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IPC IPC(8): B05C5/00B05C13/00
Inventor 林政孙元鹏赵江胜方先华万帮卫方彬彬
Owner SHENZHEN ZHENHUA MICROELECTRONICS
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