Light-emitting diode (LED) mold pressing packaging process and LED assembly

Abstract

The invention provides an LED mold pressing packaging process. The process comprises the steps of placing an LED support which is subjected to press welding in a metal gauze packing (MGP) mold; 2), injecting a silica gel mixture of liquid silica gel and fluorescent powder into a rotating cylinder of the MGP mold; 3), clamping the MGP mold; and 4), performing rotation by using a rotating rod from bottom to top, squeezing the silica gel mixture into a mold gel channel, so that the silica gel mixture enters into a cavity of the MGP mold along the gel channel, and subjecting the silica gel to curing and shaping through certain mold clamping pressure and a certain temperature. The LED mold pressing packaging process is achieved through the MGP mold, the silica gel mixture is cured and shaped, the LED packaging is completed, compared with a process that epoxy glue is used for sealing, the process has the advantages that the silica gel is used for sealing, the reliability of the LED packaging can be improved, and the service life of an LED is prolonged. The invention also provides an LED component, and the component is produced through the LED mold pressing packaging process.

Description

technical field [0001] The present invention relates to the technical field of LED packaging, and more specifically, relates to an LED molding packaging process, and the invention also relates to an LED component packaged by using the above-mentioned LED molding packaging process. Background technique [0002] LED lead-in packaging is a commonly used LED chip packaging method, which uses a lead frame as the pins of various package shapes; specifically, by bonding or sintering the die on the lead frame (generally called a bracket), the chip's The positive electrode is connected to another lead frame by wire bonding; the negative electrode is bonded in the reflector cup of the bracket with silver paste or connected with the pins of the reflector cup with gold wire; then the top is encapsulated with epoxy resin to make a certain shape. Shape, to protect the tube core from external erosion, and at the same time, the top package adopts different shapes and material properties (wi...

AI Technical Summary

Problems solved by technology

[0004] Since the above-mentioned molding and packaging process uses traditional molds, traditional molds refer to molds featuring single injection cylinders and manual loading and unloading. Only use epoxy resin for sealing

[0005] However, epoxy resin has excellent high temperature resistance, but poor low temperature resistance, which is easy to cause yellowing and light decay, and the cured epoxy resin colloid has high hardness and large internal stress, and the place where the stress exists will lead to heat accumulation, which will cause LED failure, the reliability of the LED package is lower, which reduces the service life of the LED

Images