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Heat dissipation device for reactive compensation device

A compensation device and heat sink technology, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of poor heat dissipation performance and high thermal resistance, so as to improve service life, reduce volume, and facilitate installation Effect

Inactive Publication Date: 2013-02-13
无锡市锡容电力电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a radiator for a reactive power compensation device, which can dissipate heat to the functional components of the reactive power compensation device in time, to ensure good working reliability of the functional components, good heat dissipation and insulation performance, and effective It solves the problems of poor heat dissipation and high thermal resistance in reactive power compensation devices in the prior art

Method used

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  • Heat dissipation device for reactive compensation device
  • Heat dissipation device for reactive compensation device
  • Heat dissipation device for reactive compensation device

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Embodiment Construction

[0016] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0017] see Figure 1 to Figure 3 As shown, in this embodiment, a heat sink for a reactive power compensation device includes a square heat dissipation body 1 made of an aluminum alloy plate, the size of the heat dissipation body 1 is set in accordance with the size of the functional device, and the heat dissipation One side of the main body 1 is extended with a plurality of heat dissipation fins 2 of rectangular plate structure, the heat dissipation fins 2 are arranged in parallel and at intervals, and a heat exchange channel 3 is formed between two adjacent heat dissipation fins 2, and the heat dissipation body 1 is provided with two mounting holes 4, through which the heat sink is installed on the functional device of the reactive power compensation device, the heat generated by the functional dev...

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Abstract

The invention discloses a heat dissipation device for a reactive compensation device. The heat dissipation device comprises a heat dissipation body made from thermal-sensitive materials, wherein the size of the heat dissipation body is matched with the size of a functional device, a plurality of heat dissipating fins extend on one side of the heat dissipation body, the heat dissipating fins are arranged in parallel and at intervals on a heat exchange channel between every two adjacent heat dissipating fins, a plurality of installation holes are arranged on the heat dissipation body, and the installation holes enable the heat dissipation device to be arranged on the functional device on the reactive compensation device. The heat dissipation device for the reactive compensation device can timely dissipate heat of the functional device of the reactive compensation device, ensures the functional device to have good work reliability, good heat dissipation property and good insulating property, prolongs service life of the functional device, and improves quality of the whole reactive compensation device.

Description

technical field [0001] The invention relates to a radiator, in particular to a radiator for a reactive power compensation device. Background technique [0002] At present, reactive power compensation device has become an effective measure to improve the power supply situation and increase the utilization rate of electric energy. The national power department stipulates that all places where low-voltage transformers and large-scale electrical equipment are installed should be equipped with reactive power compensation devices. In the process of simulating power circuit design It is inevitable that power devices will be used in the world. How to deal with and solve the heat dissipation problems of these power devices is very important for designers, because the operating temperature of these power devices will directly affect the working stability and safety of the entire circuit. If the heat dissipation capacity of the device If the power dissipation is limited, the power diss...

Claims

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Application Information

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IPC IPC(8): H01L23/367
Inventor 王国华许明君许锡海谷霄飞
Owner 无锡市锡容电力电器有限公司