Heat dissipation device for reactive compensation device
A compensation device and heat sink technology, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of poor heat dissipation performance and high thermal resistance, so as to improve service life, reduce volume, and facilitate installation Effect
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[0016] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.
[0017] see Figure 1 to Figure 3 As shown, in this embodiment, a heat sink for a reactive power compensation device includes a square heat dissipation body 1 made of an aluminum alloy plate, the size of the heat dissipation body 1 is set in accordance with the size of the functional device, and the heat dissipation One side of the main body 1 is extended with a plurality of heat dissipation fins 2 of rectangular plate structure, the heat dissipation fins 2 are arranged in parallel and at intervals, and a heat exchange channel 3 is formed between two adjacent heat dissipation fins 2, and the heat dissipation body 1 is provided with two mounting holes 4, through which the heat sink is installed on the functional device of the reactive power compensation device, the heat generated by the functional dev...
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