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Copper member having hybrid joint structure for forming sealed space, and joining method thereof

A closed space, mixed bonding technology, applied in the direction of connecting components, instrument parts, electrical equipment structural parts, etc., can solve the problems of weakened bond strength between adhesive and copper plate, copper plate deformation, oxidation, etc., to achieve Improves heat dissipation, prevents wear and oxidation, and improves durability

Active Publication Date: 2015-04-08
KOREA INST OF IND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, heat sinks are produced by welding multiple copper plates to each other in consideration of thermal conductivity and economic efficiency, which has the disadvantage that the copper plates are deformed or oxidized because the copper is exposed to a high-temperature working environment
In addition, if the heat sink is produced by bonding copper plates to each other, although it can be operated at a lower temperature working environment, in this case, there is also the following disadvantage: the copper plates and the bonding are damaged over time. Oxidation occurs on the surface between the adhesives, resulting in a weakening of the bonding strength between the adhesive and the copper plates, so the copper plates separate from each other

Method used

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  • Copper member having hybrid joint structure for forming sealed space, and joining method thereof
  • Copper member having hybrid joint structure for forming sealed space, and joining method thereof
  • Copper member having hybrid joint structure for forming sealed space, and joining method thereof

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Embodiment Construction

[0046] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In describing the embodiments with reference to the drawings, the same reference numerals used in different drawings denote the same or similar components, and repeated description will be omitted.

[0047] Such as figure 1 As shown, the copper component with a closed space according to the first embodiment of the present invention includes a main body including an upper connection plate 10 and a lower connection plate 20 .

[0048] The upper connecting plate 10 is located on the upper part of the copper component and has an exposed surface exposed to the outside, so that the upper connecting plate 10 conducts heat to the outside to release the heat generated by the circuit board. In addition, the upper gusset 10 has, on the opposite side of its exposed face, a first adhesive face which is in direct contact with and fastened to the lower gusset ...

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Abstract

A copper member forming a sealed space of the present invention includes an upper coupling plate of a copper material, and a lower coupling plate of a copper material that is coupled to the upper coupling plate. A sealed space, in which a functional material is filled, is formed between the upper coupling plate and the lower coupling plate. The upper coupling plate and the lower coupling plate include body portions on which bonding surfaces, for applying an adhesive along the perimeter of the sealed space, are formed. Included is a fixing part installed between bonding surfaces of the upper coupling plate and the lower coupling plate, for fixing the upper coupling plate and the lower coupling plate.

Description

technical field [0001] The present invention relates generally to a method for joining two plates of a copper part having a closed space to each other, and more particularly to a copper part formed by a hybrid joining method comprising mechanical fastening and chemical bonding, Thus, a closed space is formed between a pair of connecting plates made of copper, and the pressure in the closed space is greater than atmospheric pressure or a vacuum lower than atmospheric pressure in the closed space, so that the copper parts have appropriate durability. Background technique [0002] In industrial fields such as machinery, electronics, and electrical devices, there are various uses and ways of using heat dissipation components. When mechanical devices, electronic instruments, etc. are running, heat will inevitably be generated in parts. If heat generation is significant for the material, the general operating performance of the device will deteriorate, and in severe cases the dev...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F16B11/00B23K31/02G12B15/06
CPCB23K31/02H05K7/20481B23K2203/12F16B11/006B23K2103/12
Inventor 金準基金锺勋金祯汉李昌祐俞世勋金哲熙方政丸高溶浩
Owner KOREA INST OF IND TECH
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