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Drying agent layer preparation method, OLED (organic light emitting diode) display screen and packaging method of display screen

A technology of light emitting diode and desiccant layer, which is applied in coating, vacuum evaporation plating, metal material coating process, etc., can solve the problem of high cost, and achieve the effect of improving packaging efficiency and reducing production cost.

Inactive Publication Date: 2013-03-06
BOE TECH GRP CO LTD
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is necessary to use a package with pits, which is more expensive

Method used

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  • Drying agent layer preparation method, OLED (organic light emitting diode) display screen and packaging method of display screen
  • Drying agent layer preparation method, OLED (organic light emitting diode) display screen and packaging method of display screen
  • Drying agent layer preparation method, OLED (organic light emitting diode) display screen and packaging method of display screen

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Embodiment Construction

[0024] Embodiments of the present invention provide a method for preparing a desiccant layer, an organic light-emitting diode display screen and a packaging method thereof. A desiccant layer is provided on the packaging cover plate, and the desiccant layer can effectively absorb the infiltrated water and oxygen, and the packaging cover plate and The edge of the substrate is sealed and connected, and the desiccant layer and the device on the substrate are sealed in the sealed cavity. In the organic light-emitting diode display screen provided by the embodiment of the present invention, since the desiccant layer is used, and the desiccant layer can be directly arranged on the packaging cover plate, it is not necessary to use the traditional non-transparent sheet-shaped desiccant sheet and separate the desiccant sheet Layer by layer is attached to the groove of the packaging sheet, so there is no need to manufacture the packaging sheet with grooves, which improves the packaging ef...

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Abstract

The embodiment of the invention provides a drying agent layer preparation method, an OLED (organic light emitting diode) display screen and a packaging method of the display screen, relating to an OLED display technology. A drying agent layer is arranged on a packaging cover plate and can be used for effectively absorbing penetrated water oxygen, connecting the packaging cover plate with the edge of a substrate in a sealed manner and sealing the drying agent layer and a device on the substrate in a sealing cavity. According to the OLED display screen provided by the embodiment of the invention, the adopted drying agent layer can be directly arranged on the packaging cover plate, thereby avoiding the conventional non-transparent drying agent sheets which need to be adhered into a groove of a packaging sheet one layer by one layer, and also avoiding the packaging sheet with the groove. Therefore, the packaging efficiency of the OLED display screen can be improved, and the production cost can be reduced.

Description

technical field [0001] The invention relates to an organic light emitting diode display technology, in particular to a preparation method of a desiccant layer, an organic light emitting diode display screen and a packaging method thereof. Background technique [0002] AM-OLED (Active Organic Light Emitting Diode) display has a series of advantages such as wide viewing angle, fast response, wide operating temperature, ultra-thin, flexible display, transparent display, etc. AM-OLED display can be divided into top emission and bottom emission Emissive AM-OLED display, top-emitting AM-OLED display needs to emit light from the top of the display, bottom-emitting AM-OLED display needs to emit light from the bottom of the display, in comparison, top-emitting AM-OLED The display screen has a higher aperture ratio and can obtain higher brightness, but due to the need to emit light from the top of the display screen, the top of the top-emitting AM-OLED display screen cannot be provide...

Claims

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Application Information

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IPC IPC(8): H01L27/32C23C14/35C23C14/04
CPCC23C14/042C23C14/082H10K59/8722H10K59/874H10K59/80H10K59/00H10K50/846H10K50/841
Inventor 洪瑞李周炫金东焕
Owner BOE TECH GRP CO LTD
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